Roll-to-roll gravure printed silver patterns to guarantee printability and functionality for mass production

Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating

“…In R2R gravure printing, doctoring defects, which often occur when using Ag nanoparticle ink, significantly affect the device performance. For that reason, Ag flake gravure paste (purchased from Fine Paste Co.), which has a large particle size, was used as the conductive layer to prevent doctoring defects [22]. In addition, Ag nanoparticle ink Fig.…”

“…In detail, the nip and doctoring pressure determine the filling, setting, and printing phase on the gravure cell to the substrate. The optimized value of pressure was selected by the experimental procedure followed in previous work [31,22]. After finishing the gravure printing process, the wound film was sampled by a slitting process and was laser-drilled at the interconnection point.…”

“…Recently, studies have investigated stable and unstable regions of several parameters in R2R gravure printing. Furthermore, to minimize the printing scale and improve important process parameters, guidelines have been suggested for optimizing the R2R gravure printing process [21,22].…”

High aspect ratio silver grid transparent electrodes using UV embossing process

“…Recently, many studies have investigated the fabrication of metal grids with printing processes such as offset, ink jet, and gravure printing processes, which have an aspect ratio lower than 1. [18][19][20] This paper introduces a UV embossing process to fabricate metal grid transparent electrodes with a high aspect ratio (∼3). The silver ink has a high conductivity and low annealing temperature.…”

Effects of the Particle Size and the Solvent in Printing Inks on the Capacitance of Printed Parallel-Plate Capacitors

“…Each functional layer shows various characteristics, and the device types are determined when the layers are overlaid in different sequences in the multi-layer structure. The main performance parameters measured include the electrical resistivity of conductive patterns, the permittivity of the dielectric layer, the mobility of the semiconducting layer, and mechanical properties, such as the thickness and roughness of the printed surface [14][15][16].…”