Role of stacking fault energy in confined layer slip in nanolaminated Cu

Ji, Weisen; Jian, Wu-Rong; Su, Yanqing; Xu, Shuozhi; Beyerlein, Irene J.

doi:10.1007/s10853-023-08779-8

Cited by 5 publications

(5 citation statements)

References 63 publications

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“…Unlike the previous work, however, the dislocation was also expanded within the slip plane in Ag10Cu (but not in Ag8Cu), as shown in Figure 10. We note that the Ag10Cu case has the highest peak stress among all glides in the Ag layer, in agreement with the previous findings that dislocation climb tends to occur when the critical stresses for CLS are high [14,30].…”

Section: Ag/cu Type II Nanolaminatesupporting

confidence: 92%

“…The atomic configurations corresponding to the movement of dislocation in glide plane 8 in the Ag layer and plane 1 in the Cu layer are shown in Figures 10 and 11, respectively. In the cases of Ag8Cu and Ag10Cu, the dislocation partially climbs in the Ag layer, similar to the finding in a nanolaminated Cu [30]. Unlike the previous work, however, the dislocation was also expanded within the slip plane in Ag10Cu (but not in Ag8Cu), as shown in Figure 10.…”

Section: Ag/cu Type II Nanolaminatesupporting

confidence: 83%

“…Molecular dynamics (MD) simulation has been utilized to explore the processes of deformation in nanolaminate materials at both atomic and nanometer scales [ 28 , 29 , 30 ]. Up until now, the role of interface structure in contributing to CLS has not been extensively studied.…”

Section: Introductionmentioning

confidence: 99%

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Confined Layer Slip Process in Nanolaminated Ag and Two Ag/Cu Nanolaminates

Fani,

Jian,

et al. 2024

Materials

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The exceptional strength of nanolaminates is attributed to the influence of their fine stratification on the movement of dislocations. Through atomistic simulations, the impact of interfacial structure on the dynamics of an edge dislocation, which is compelled to move within a nanoscale layer of a nanolaminate, is examined for three different nanolaminates. In this study, we model confined layer slip in three structures: nanolaminated Ag and two types of Ag/Cu nanolaminates. We find that the glide motion is jerky in the presence of incoherent interfaces characterized by distinct arrays of misfit dislocations. In addition, the glide planes exhibit varying levels of resistance to dislocation motion, where planes with intersection lines that coincide with misfit dislocation lines experience greater resistance than planes without such intersection lines.

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Section: Ag/cu Type II Nanolaminatesupporting

confidence: 92%

Section: Ag/cu Type II Nanolaminatesupporting

confidence: 83%

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Confined Layer Slip Process in Nanolaminated Ag and Two Ag/Cu Nanolaminates

Fani,

Jian,

et al. 2024

Materials

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“…In the realm of metallic multilayers, previous investigations into Cu/Ni multilayers have predominantly attributed the observed strengthening mechanisms to the interplay of layer thickness and coherency stress at interfaces [7,16,23,28,29]. The layer thickness effect, as elucidated by these studies, underscores the significance of the physical dimensions of induvial layers in determining the mechanical properties of the multilayer structure.…”

Section: Introductionmentioning

confidence: 86%

“…For multilayers with an individual layer thickness of 50 nm and greater, strengthening occurs by dislocation pile-up at the layer interfaces which can be explained by the Hall-Petch relation [10][11][12][13]. When the layer thickness is between 10 and 50 nm, due to strong repulsion among like-sign coplanar dislocations, the multilayer strengthening can be explained by confined layer slip (CLS) [14][15][16][17], involving the movement of a single dislocation loop parallel to the interface within individual layers. The multilayer strength approaches the theoretical value when the layer thickness is around 5 nm.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties of Thermally Annealed Cu/Ni and Cu/Al Multilayer Thin Films: Solid Solution vs. Intermetallic Strengthening

Zhou,

Wang

2024

Metals

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In this study, Cu/Ni and Cu/Al multilayers, with individual layer thickness varying from 25 nm to 200 nm, and co-sputtered Cu-Ni and Cu-Al single layer films were deposited at room temperature via magnetron sputtering and further annealed from 100 °C to 300 °C. The mechanical and microstructural properties of the as-deposited and annealed samples were characterized by nanoindentation, x-ray diffraction, and scanning electron microscopy. Both multilayer systems exhibit an increase in hardness with increasing annealing temperature. However, the Cu/Ni system shows a gradual and moderate hardness increase (up to 30%) from room temperature to 300 °C, while the Cu/Al system displays a sharp hardness surge (~150%) between 125 °C and 200 °C. The co-sputtered Cu-Ni and Cu-Al samples consistently demonstrate higher hardness than their multilayered counterparts, albeit with distinctly different temperature dependence—the hardness of Cu-Ni increases with annealing temperature while Cu-Al maintains a constant high hardness throughout the entire temperature range. The distinct thermal strengthening mechanisms observed in the two metallic multilayer systems can be ascribed to the formation of solid solutions in Cu/Ni and the precipitation of intermetallic phases in Cu/Al. This study highlights the unique advantage of intermetallic strengthening in metallic multilayer systems.

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