Role of slurry in single crystal sapphire lapping with fixed abrasive pad

Jian-bin, 王建彬 Wang; Yong-wei, 朱永伟 Zhu; Chun-xiang, 谢春祥 Xie; Jun, 徐俊 Xu; Zhi-lan, 居志兰 Ju

doi:10.3788/ope.20142211.3004

Cited by 6 publications

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“…3M Company 12 has prepared the FAP for lapping and polishing electronic chips to avoid these inherent disadvantages. In order to improve the processing performances of FAP, the hydrophilic fixed abrasive pad (FAP) was present by Kim et al 13 , 14 and Zhu Yongwei 15 – 18 respectively, and the processing mechanism and process of sapphire, spinel and quartz glass were also explored by taking experiments with FAP. From the above, there are many studies about the lapping technology with FAP now, but little on Si 3 N 4 ceramics lapping with FAP.…”

Section: Introductionmentioning

confidence: 99%

The effect of slurries on lapping performance of fixed abrasive pad for Si₃N₄ ceramics

et al. 2020

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In this paper, a series of experiments were carried out to explore the effect of slurry pH on materials removal rate (MRR) and surface quality in lapping of Si3N4 ceramics wafers with fixed abrasive pad (FAP) using different slurries with different pH. Then, the scanning electron microscope was employed to detect the microtopography and abrade smooth of FAP for exploring the effect of slurries pH on self-conditioning of pad. Experimental results demonstrated that the roughness of wafers increase with the increasing of slurry pH value. The surface of wafers is the best when the pH = 1 and the worst When the pH = 13. The MRR decreases firstly and then decreases with the increasing of the pH. The MRR reaches the lowest when slurry pH = 7, and reaches the highest when slurry pH = 13. These results further suggest that the soften layer of SiO2 could be formed due to the reactions between water and materials on wafer surface, which facilitates increasing material remove rate and improving the surface quality. The hydrogen ion and triethanolamine in slurry could react with the copper in fixed abrasive pad, which also could enhance the materials remove rate and affect the surface quality.

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Section: Introductionmentioning

confidence: 99%

The effect of slurries on lapping performance of fixed abrasive pad for Si₃N₄ ceramics

et al. 2020

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Effect of chemical additive on fixed abrasive pad self-conditioning in CMP

Huang

Xia

et al. 2016

Int J Adv Manuf Technol

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Effect of particle size on friction signal characters when lapping quartz glass with fixed abrasive pad

Zhang

Zheng

Wang

et al. 2022

Int J Adv Manuf Technol

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Role of slurry in single crystal sapphire lapping with fixed abrasive pad

Cited by 6 publications

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The effect of slurries on lapping performance of fixed abrasive pad for Si₃N₄ ceramics

The effect of slurries on lapping performance of fixed abrasive pad for Si₃N₄ ceramics

Effect of chemical additive on fixed abrasive pad self-conditioning in CMP

Effect of particle size on friction signal characters when lapping quartz glass with fixed abrasive pad

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Role of slurry in single crystal sapphire lapping with fixed abrasive pad

Cited by 6 publications

References 0 publications

The effect of slurries on lapping performance of fixed abrasive pad for Si3N4 ceramics

The effect of slurries on lapping performance of fixed abrasive pad for Si3N4 ceramics

Effect of chemical additive on fixed abrasive pad self-conditioning in CMP

Effect of particle size on friction signal characters when lapping quartz glass with fixed abrasive pad

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Product

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The effect of slurries on lapping performance of fixed abrasive pad for Si₃N₄ ceramics

The effect of slurries on lapping performance of fixed abrasive pad for Si₃N₄ ceramics