Role of quantum mechanisms and thermal heating in low-temperature creep of metals

Startsev, V. I.; Soldatov, V. P.; Нацик, В. Д.; Abraimov, V. V.

doi:10.1002/pssa.2210590150

Cited by 13 publications

(4 citation statements)

References 19 publications

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“…Early proponents included [20,24,26,27]. Conversely, subsequent work by [13,22,23] suggests that, even to 4 K, creep is time-dependent and is a result of the thermal activation of dislocations.…”

Section: Discussion Of the Mechanisms Of Low-temperature Creep Logarimentioning

confidence: 91%

“…Seeger et al [19,33,34] proposed a dislocation intersection mechanism for pure FCC metals under polyslip. Others have suggested that creep occurs due to quantum mechanical tunneling of dislocations at very low temperature [13,20,22,24,26,27], but there is no consensus as to the actual mechanisms involved.…”

Section: Introductionmentioning

confidence: 96%

“…However, some materials do demonstrate significant creep at T \ 0.3T m and, furthermore, at stresses both above and below the macroscopic yield stress (r 0:002 y ). These materials include Ti-alloys and steels [1][2][3][4][5][6][7][8][9][10], Al-Mg [11], a-Brass [12], ionic solids [13], pure Au, Cd, Cu, Al, Ti, Hg, Ta, Pb, Zn [14][15][16][17][18][19][20][21][22][23][24][25][26][27][28], and precipitation hardened alloys [29] (as well as glass and rubber [28]). Materials may undergo plasticity that affects its intended (e.g., structural and electrical [30][31][32]) performance.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Low-temperature creep in pure metals and alloys

2015

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Many crystalline materials are known to exhibit creep at low temperatures (T \ 0.3T m ). Here, we review and analyze the phenomenological relationships that describe primary creep. The discussion focuses on the controversy as to whether power-law or logarithmic descriptions better describe the experimental database. We compile data from the literature as well as new copper data recently taken by the authors. Depending on the material, it appears that the logarithmic form can somewhat better describe creep behavior at low temperatures, while the power-law behavior manifests at intermediate temperatures. The basic mechanism(s) of low-temperature creep plasticity is examined, as well.

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Section: Discussion Of the Mechanisms Of Low-temperature Creep Logarimentioning

confidence: 91%

Section: Introductionmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

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Low-temperature creep in pure metals and alloys

2015

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“…Exceptional reviews of the widespread studies on the topic may be found in some important references [80][81][82]. Also, some studies were done regarding the proposition of quantum mechanical tunneling of dislocations at very low temperature [83][84][85][86][87][88].…”

Section: Creep 200mentioning

confidence: 99%

Review on Creep Analysis and Solved Problems

Monfared¹

2018

Creep

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This chapter presents a useful literature reviews and applied solved problems that focus on the creep phenomenon and behavior of it in the solids. Various insights and available studies are reviewed and investigated regarding the creep behavior analysis in three categories such as analytical, numerical and experimental methods. In addition, novel and recent findings are presented in this chapter such as predicting and obtaining the viscosity of the solids at high temperatures using steady state creep phenomenon (i.e., introducing a simulation and analogy between creeping solids and viscous fluids).

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Specification of the dislocation mobility analysis in the low-temperature range

Нацик

Kavfmann

1981

Phys. Stat. Sol. (a)

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The results of a theoretical analysis of the combined effect of thermal and quantum fluctuations on dislocation motion in Peierls relief and through local barriers are given from an unified point of view. The procedure of the analysis of experimental data on low temperature dislocation mobility allowing to connect observed peculiarities of mobility with characteristics of potential barriers and quantum properties of dislocations is proposed. This procedure is used to analyze experimental data on dislocation mobility in single copper crystals obtained in a previous paper. It is shown that temperature anomalies observed are satisfactorily explained within the theory of quantum dislocation motion through local barriers.

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Role of quantum mechanisms and thermal heating in low-temperature creep of metals

Cited by 13 publications

References 19 publications

Low-temperature creep in pure metals and alloys

Low-temperature creep in pure metals and alloys

Review on Creep Analysis and Solved Problems

Specification of the dislocation mobility analysis in the low-temperature range

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