2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159586
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Role of encapsulation formulation on charge transport phenomena and HV device instability

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Cited by 4 publications
(1 citation statement)
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“…Furthermore, the space charge could degrade semiconductor leakage current characteristics by strengthening the electric field in semiconductor substrate region. The influence of space charge transportation and accumulation on surface of semiconductor chip has been discussed in [3][4][5][6] using TCAD simulation. Reliability tests of IGBT devices under accelerated conditions were reported in [7,8], showing that the degradation (increase) of leakage current of the device is caused possibly by the formation of space charge on the surface at semiconductor edge termination area.…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, the space charge could degrade semiconductor leakage current characteristics by strengthening the electric field in semiconductor substrate region. The influence of space charge transportation and accumulation on surface of semiconductor chip has been discussed in [3][4][5][6] using TCAD simulation. Reliability tests of IGBT devices under accelerated conditions were reported in [7,8], showing that the degradation (increase) of leakage current of the device is caused possibly by the formation of space charge on the surface at semiconductor edge termination area.…”
Section: Introductionmentioning
confidence: 99%