Role of Crystallographic Orientation of β-Sn Grain on Electromigration Failures in Lead-Free Solder Joint: An Overview

Bashir, M. Nasir; Butt, Sajid Ullah; Mansoor, Muhammad Adil; Khan, Niaz Bahadur; Bashir, Shahid; Wong, Yew Hoong; Alamro, Turki; Eldin, Sayed M.; Jameel, Mohammed

doi:10.3390/coatings12111752

Cited by 6 publications

(3 citation statements)

References 72 publications

(120 reference statements)

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“…Current will cause the directional migration of atoms, which accelerates or inhibits the growth of IMCs, resulting in microcracks, voids, and other defects [23,24]. The mechanism of the influence of the current on the reliability is shown in Figure 7.…”

Section: Resultsmentioning

confidence: 99%

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Wang

et al. 2023

Coatings

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New diamond chip resistors have been used in high-power devices widely due to excellent heat dissipation and high-frequency performance. However, systematic research about their solder joint reliability is rare. In this paper, a related study was conducted by combining methods between numerical analysis and laboratory reliability tests. In detail, the shape simulation and thermal cycling finite element simulation for solder joints with different volumes were carried out. The optimized solder volume was 0.05 mm3, and the maximum thermal cycling stress under the optimized shape was 38.9 MPa. In addition, the thermal cycling tests with current and high temperature storage tests were carried out for the optimized solder joint, which showed good agreement with the simulation results, clarified the growth and evolution law of intermetallic compound at the interconnection interface, and proved the optimized solder joint had great anti-electromigration, temperature cycling and high temperature storage reliability. In this work, an optimized solder joint structure of a diamond chip resistor with high reliability was finally obtained, as well as providing considerable reliability data for the new type of diamond chip resistors, which would boost the development of power devices.

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Section: Resultsmentioning

confidence: 99%

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Wang

et al. 2023

Coatings

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“…When the β-Sn crystal c-axis and current form a certain angle θ, a it was observed that high θ angle reduces the Cu migration and lower θ angle facilitates the Cu atoms migration which results in EM failures. When the direction of the current and the direction of the c-axis are in the same direction, the number of atomic migrations and defects caused by electromigration increases rapidly [ 123 ].…”

Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

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Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

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“…With the progress of lead-free solders, SnPb has been gradually abandoned due to the great harm to human beings and the environment, and there have been efforts to obtain a lead-free solder that can mimic the properties of SnPb solders [4][5][6][7][8]. The SnBi solder has received great attention due to its low cost, low melting point and high strength, and it is widely used in low-temperature packaging for electronic products [9].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Gao

Zhang

et al. 2023

Metals

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Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the interfacial intermetallic compound (IMC) and mechanical properties of Sn58Bi/Cu solder joints were studied for different Joule heating properties. The results showed that as the cross-sectional area of the Sn58Bi/Cu solder joints increased, the Joule heating of the joint increased. The anode IMC thickness of the joint thickened and transformed into a planar shape. The Bi migrated to the anode region to form a Bi-rich layer and gradually increased in thickness. The cathode IMC thickness first increased, then decreased, and gradually dissolved. The Sn-rich layer formed near the solder side and gradually increased in thickness, with microcracks occurring when the cross-sectional area of the joint increased to 0.75 mm2. The joint shear fracture path moved from the soldering zone near the cathode IMC layer to the interfacial IMC layer. The fracture mechanism of the joint changed from a mixed brittle/tough fracture, dominated by deconstruction and secondary cracking, to a brittle fracture dominated by deconstruction. The joint shear strength was reduced by 60.9% compared to that in the absence of electromigration.

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Role of Crystallographic Orientation of β-Sn Grain on Electromigration Failures in Lead-Free Solder Joint: An Overview

Cited by 6 publications

References 72 publications

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Study on the Solder Joint Reliability of New Diamond Chip Resistors for Power Devices

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

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