Role of crack length, crack spacing and layer thickness ratio in the electric potential and temperature of thermoelectric bi-materials systems

Jiang, Duyin; Zhou, Yue‐Ting

doi:10.1016/j.engfracmech.2021.108170

Cited by 9 publications

(4 citation statements)

References 33 publications

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“…Depending on the specific parameters characterizing the bonded materials, the electric current could either amplify or diminish the thermal SIFs. As highlighted by Jiang and Zhou [2], the SIFs in the context of dual collinear interface cracks within TEBM, under combined electric and thermal loads, experience alterations due to several factors: crack length, crack spacing, and the ratio of bi-elastic constants. These researchers approached the problem by employing Laplace equations and considering the driving influences originating from electric current density and energy flux.…”

Section: Introductionmentioning

confidence: 99%

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Derivation of hyper-singular integral equations for thermoelectric bonded materials featuring a crack parallel to interface

Mohd Nordin,

Hamzah,

Khashiie

et al. 2023

Math. Model. Comput.

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In this paper, the derivation of hyper-singular integral equations (HSIEs) for thermoelectric bonded materials (TEBM) featuring a crack parallel to interface subject to in-plane shear stress τ∞xy was intensively studied. Generally, stress intensity factors (SIFs) were calculated using HSIEs with the help of modified complex stress variable function (MCSVF), and continuity conditions of the resultant electric force and displacement electric function. The unknown crack opening displacement (COD) function, electric current density, and energy flux load are mapped into the square root singularity function using the curved length coordinate method as the right-hand term. This unknown function is then used to compute the dimensionless SIFs in order to determine the stability behavior of TEBM featuring a crack parallel to interface subject to in-plane shear stress τ∞xy. Numerical results of the dimensionless SIFs at all the crack tips are presented. Our results are totally in good agreement with those of the previous works. It is observed that the dimensionless SIFs at the crack tips depend on the elastic constants ratio, the crack geometries, the electric conductivity, and the thermal expansion coefficients.

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Section: Introductionmentioning

confidence: 99%

“…Their findings revealed that the inclusion's presence led to a decrease in the conversion efficiency of the TEBM. Jiang and Zhou [5] conducted an investigation into how dual collinear interface cracks affect the electric potential and temperature distribution in a TEBM system. This system was subjected to both electric and thermal loads.…”

Section: Introductionmentioning

confidence: 99%

Derivation of hyper-singular integral equations for thermoelectric bonded materials featuring a crack parallel to interface

Mohd Nordin,

Hamzah,

Khashiie

et al. 2023

Math. Model. Comput.

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show abstract

“…The dimensionless SIFs are affected by crack length, crack spacing, and the bi-elastic constant ratio for dual collinear interface cracks on the electric potential and temperature of Thermoelectric Bonded Materials (TEBM) subjected to electric and thermal loads [9]. They solved SIFs using Laplace equations and the driving forces of ECD and EFL.…”

Section: Introductionmentioning

confidence: 99%

Stress Intensity Factors for Thermoelectric Bonded Materials Weakened by an Inclined Crack

Muhammad Haziq Iqmal Mohd Nordin,

Khairum Hamzah,

Nik Mohd Asri Nik Long

et al. 2024

ARAM

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Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown functions of Crack Opening Displacement (COD), Electric Current Density (ECD), and Energy Flux Load (EFL) are mapped onto the square root singularity function. The resulting equations are then numerically solved using appropriate quadrature formulas, with the traction along the crack utilized as the right-hand term. The obtained COD, ECD and EFL functions is then used to compute the dimensionless Stress Intensity Factors (SIFs) in order to determine the stability behavior of TEBM weakened by an ICP. The numerical results provided demonstrate the dimensionless SIFs at the crack tips. These results exhibit excellent agreement with previous studies conducted on the subject. Additionally, it is observed that the dimensionless SIFs at the crack tips are influenced by factors such as the ratio of Elastic Constants (ECR), the geometry of the cracks, and the coefficients associated with the Electric Current Density (ECD).

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“…They discovered that combining a thermoelectric module and a photovoltaic cell with a low temperature coefficient can increase in total electric power. According to Jiang and Zhou [36], SIFs are affected by crack length, crack spacing, and the bi-elastic constant ratio for dual collinear interface cracks on the electric potential and temperature of thermoelectric-bonded materials subjected to electric and thermal loads. Moreover, they solved SIFs using Laplace equations and the driving forces of electric current density and energy flux.…”

Section: Introductionmentioning

confidence: 99%

Formulation for Multiple Cracks Problem in Thermoelectric-Bonded Materials Using Hypersingular Integral Equations

et al. 2023

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New formulations are produced for problems associated with multiple cracks in the upper part of thermoelectric-bonded materials subjected to remote stress using hypersingular integral equations (HSIEs). The modified complex stress potential function method with the continuity conditions of the resultant electric force and displacement electric function, and temperature and resultant heat flux being continuous across the bonded materials’ interface, is used to develop these HSIEs. The unknown crack opening displacement function, electric current density, and energy flux load are mapped into the square root singularity function using the curved length coordinate method. The new HSIEs for multiple cracks in the upper part of thermoelectric-bonded materials can be obtained by applying the superposition principle. The appropriate quadrature formulas are then used to find stress intensity factors, with the traction along the crack as the right-hand term with the help of the curved length coordinate method. The general solutions of HSIEs for crack problems in thermoelectric-bonded materials are demonstrated with two substitutions and it is strictly confirmed with rigorous proof that: (i) the general solutions of HSIEs reduce to infinite materials if G1=G2, K1=K2, and E1=E2, and the values of the electric parts are α1=α2=0 and λ1=λ2=0; (ii) the general solutions of HSIEs reduce to half-plane materials if G2=0, and the values of α1=α2=0, λ1=λ2=0 and κ2=0. These substitutions also partially validate the general solution derived from this study.

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Role of crack length, crack spacing and layer thickness ratio in the electric potential and temperature of thermoelectric bi-materials systems

Cited by 9 publications

References 33 publications

Derivation of hyper-singular integral equations for thermoelectric bonded materials featuring a crack parallel to interface

Derivation of hyper-singular integral equations for thermoelectric bonded materials featuring a crack parallel to interface

Stress Intensity Factors for Thermoelectric Bonded Materials Weakened by an Inclined Crack

Formulation for Multiple Cracks Problem in Thermoelectric-Bonded Materials Using Hypersingular Integral Equations

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