Stress Intensity Factors for Thermoelectric Bonded Materials Weakened by an Inclined Crack
Muhammad Haziq Iqmal Mohd Nordin,
Khairum Hamzah,
Nik Mohd Asri Nik Long
et al.
Abstract:Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown … Show more
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