“…In this context, to take advantage of the extreme simplicity of this nonlithographic, external field‐free, top‐down technique and exploit its full potential for developing miniaturized optical, electronic, optoelectronic, magnetic devices, and so forth, control of the evaporative flux, solution concentration, and interfacial interactions among the solvent, solute, and substrate is necessary to construct highly ordered, complex structures rapidly and cheaply over large areas. To date, a few impressive studies have centered on the precise manipulation of the evaporation process, including controlled anisotropic wetting/dewetting processes15, 16 controlled dewetting by dip‐coating,17 convective assembly in evaporating menisci,18 evaporation‐induced assembly in restricted geometries,19–29 and evaporative lithography using a mask,30, 31 to create complex deposit patterns with unprecedented regularity.…”