A miniaturized lumped-element balun is proposed for the very high frequency band applications. The miniaturization is accomplished by the inductor-capacitor (L-C) surrounded resonator, which places a vertically interdigital-capacitor inside spiral inductor for higher integration. The L-C surrounded resonator only takes up one element's area without increasing the number of substrate layers. The balun is built on a 10-layer thickness low temperature co-fired ceramic substrate and has the smallest reported size of only 0.004 × 0.003 × 0.0003λ g . Moreover, the proposed balun also has a second-order harmonic suppression of 40 dB. Furthermore, thermal boundary analysis, comparisons, and discussions are also implemented.