2022
DOI: 10.13164/re.2022.0455
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Compact LTCC Balun using L-C Embraced Structure for 128 MHz 3T MRI Applications

Abstract: A compact lumped-element balun is proposed for 128 MHz frequency 3 Tesla (T) magnetic resonance imaging (MRI) applications. The proposed L-C embraced structure places vertically-interdigital-capacitor (VIC) inside spiral inductor, thus three L-C elements only take up one inductor's area. Therefore, significant size reduction and integration increment are both achieved without increasing the number of substrate layers. The balun is built on a 10-layer thickness low temperature co-fired ceramic (LTCC) substrate … Show more

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Cited by 2 publications
(1 citation statement)
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“…However, Capacitance lower than 20 pF and inductance lower than 40 nH are impractical to make smaller parts at the VHF-band [1]. Recently, three-dimension (3D) system-in-package technology of low temperature co-fired ceramic (LTCC) uses capacitance increased vertically-interdigital-capacitors (VICs) [2,3] for circuit miniaturization with high Q-factors [4][5][6][7][8][9]. GaAs, SiGe, and CMOS have also been used to build compact passive components with lumped elements [10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…However, Capacitance lower than 20 pF and inductance lower than 40 nH are impractical to make smaller parts at the VHF-band [1]. Recently, three-dimension (3D) system-in-package technology of low temperature co-fired ceramic (LTCC) uses capacitance increased vertically-interdigital-capacitors (VICs) [2,3] for circuit miniaturization with high Q-factors [4][5][6][7][8][9]. GaAs, SiGe, and CMOS have also been used to build compact passive components with lumped elements [10][11][12].…”
Section: Introductionmentioning
confidence: 99%