RF Packaging for Space Applications: from Micropackage to SOP – “System On a Package”

High loading of nanostructured ceramics in polymer composite thick films by aerosol deposition

“…These desired properties have produced many studies into the technology and integration of components on substrates, such as printed circuit boards [PCB], multi-chip modules, and system-in-a-package methodologies [1-4]. As a next generation electronic packaging technology, system-on-package integrates both the active components (digital integrated circuits [ICs], analog ICs, memory modules, and MEMS) and the embedded passive components (capacitors, resistors, and inductors) into a multilayer-integrated substrate and provides an improved miniaturization through three dimensional [3-D] lamination [5-7]. Moreover, the high-frequency properties of the components have grown in importance due to rising demands on wireless communications.…”

Application of Al2O3-based polyimide composite thick films to integrated substrates using aerosol deposition method

“…Today, the integration has developed from two-dimensional integration on substrates to three-dimensional integration such as system-on-package (SOP) [1][2][3]. To fabricate the high performance integrated substrate, however, there are some problems to be solved as follows.…”

MEMS for wireless communications: from RF-MEMS components to RF-MEMS-SiP

“…Further, as suitable co-fired resistive and capacitive materials for making embedded passives in HTCC do not exist (or at least are not utilized), the integration of passives is limited to post-fired hybrid mounted components. The advantage of HTCC is the excellent thermal conductivity of the ceramics (in particular for AlN), which makes it a very reliable candidate for high-demanding applications such as space [111] and for high-power applications. In LTCC on the other hand, the firing temperatures are much lower (around 850 • C), thus allowing the use of good conductive materials such as gold, copper or silver.…”