Abstract:PurposeThe purpose of this paper is to present a new class of printed circuit board (PCB)‐based, radio frequency micro‐electro‐mechanical systems (RF‐MEMS) switches and to describe the packaging method and evaluate performance.Design/methodology/approachTraditional PCB materials and processes were combined with photolithographic high‐density interconnect (HDI) and MEMS to form 3D high‐performance RF switches.FindingsA new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to… Show more
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