2017
DOI: 10.1149/2.0011710jss
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Review—Silicon Nitride and Silicon Nitride-Rich Thin Film Technologies: Trends in Deposition Techniques and Related Applications

Abstract: This article provides an overview of the state-of-the-art chemistry and processing technologies for silicon nitride and silicon nitride-rich films, i.e., silicon nitride with C inclusion, both in hydrogenated (SiNx:H and SiNx:H(C)) and non-hydrogenated (SiNx and SiNx(C)) forms. The emphasis is on emerging trends and innovations in these SiNx material system technologies, with focus on Si and N source chemistries and thin film growth processes, including their primary effects on resulting film properties. It al… Show more

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Cited by 127 publications
(79 citation statements)
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References 141 publications
(322 reference statements)
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“…In recent years, atomic layer deposition (ALD) has received great attention due to its unique features, such as the ability to prepare highly conformal thin films on high-aspect ratio substrates and to control the film thickness on an atomic level [ 13 , 14 ]. The self-limiting surface reaction in ALD leads to a continuous pinhole-free film, which can be used to deposit different metals, metal oxides and nitrides at relatively low temperatures [ 15 , 16 , 17 ]. Due to the high density of ALD thin films, single-layer and multi-layer stacks of TiO 2 by thermal- and plasma-assisted ALD have been used for packaging and moisture-proof purposes [ 18 , 19 ].…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, atomic layer deposition (ALD) has received great attention due to its unique features, such as the ability to prepare highly conformal thin films on high-aspect ratio substrates and to control the film thickness on an atomic level [ 13 , 14 ]. The self-limiting surface reaction in ALD leads to a continuous pinhole-free film, which can be used to deposit different metals, metal oxides and nitrides at relatively low temperatures [ 15 , 16 , 17 ]. Due to the high density of ALD thin films, single-layer and multi-layer stacks of TiO 2 by thermal- and plasma-assisted ALD have been used for packaging and moisture-proof purposes [ 18 , 19 ].…”
Section: Introductionmentioning
confidence: 99%
“…Relative permittivity ε r Thermal conductivity κ [W m −1 K −1 ] Water 1.777 [17] 0.6 [17] Gold ref. [43] 317.0 [12] Glass 2.310 [44] 4.0 [44] Si 3 N 4 4.064 [45] 30.0 [46] Figure 1. Schematic of the simulated free-standing nanocone.…”
Section: Methodsmentioning
confidence: 99%
“…In addition, silicon nitride nonvolatile memories (NVM) have been well-established and various charge-trapping memory devices are commercial nowadays (e.g., BiCS, SONOS). Their acceptance by the community is mainly attributed to the intrinsic bulk defects that act as trapping levels for both electrons and holes [13][14][15]. The resistive switching and conduction mechanism in SiN memristors is directly related to these intrinsic defects, as has been shown by several research groups [16][17][18].…”
Section: Introductionmentioning
confidence: 99%