Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Khazaka, Rabih; Mendizabal, L.; Henry, David D.

doi:10.1007/s11664-014-3202-6

Cited by 161 publications

(37 citation statements)

References 34 publications

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“…11. Mechanical characterization results of samples synthesized at VT While the decrease in shear stress of a sintered silver bond with rising temperature and decreasing displacement rate, as observed in this study, conforms to the trends that exist in the open literature [5,19], more work is required to ascertain the exact behavior of the silver paste at the microstructural level under these conditions.…”

Section: Pressure-less Samples (Vt)supporting

confidence: 82%

“…In the past few years, several studies were conducted to determine the shear strength and other mechanical properties of sintered silver joints. Khazaka et al [5] conducted a detailed study reviewing the different sintering parameters that affect the shear strength of nano-silver joints. A comprehensive literature survey of the reliability studies performed by various researchers is also provided.…”

Section: Introductionmentioning

confidence: 99%

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Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paret

Major

DeVoto

et al. 2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystem

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Sintered silver-based bonded interfaces are a critical enabling technology for high-temperature, compact, highperformance, and reliable wide-bandgap packages and components. High-pressure (~40 MPa) sintered silver interfaces have been implemented commercially, most notably the commercial products offered by Semikron. To reduce manufacturing complexity, there is significant industry interest in pressure-less sintered silver interfaces. To this end, current formulations of sintered silver paste are comprised of purely nano-sized silver particles or a combination of nano-and micro-sized silver particles/flakes. It is essential to quantify the mechanical properties and determine the reliability of these interfaces prior to use in automotive power electronics applications. In this paper, research efforts at the National Renewable Energy Laboratory, in collaboration with Virginia Polytechnic Institute and State University and an industry partner, in optimizing the synthesis procedure and mechanical characterization of sintered silver double-lap samples are described. These double-lap samples were synthesized using pressure-less sintering techniques. Shear testing was conducted at multiple temperatures and displacement rates on these samples sintered using two types of sintered silver pastes, one of them consisting of nano-silver particles and the other a hybrid paste or a combination of nano-and micron-sized silver flakes, employed in a double-lap configuration. Maximum values of shear stress obtained from the characterization study are reported.

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Section: Pressure-less Samples (Vt)supporting

confidence: 82%

Section: Introductionmentioning

confidence: 99%

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paret

Major

DeVoto

et al. 2018

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystem

View full text Add to dashboard Cite

show abstract

“…Currently, the development of a bonding method that works at temperatures below 300 1C is important for electronic packaging and interconnections [1][2][3][4][5][6][7]. In this study, we developed a process that possesses the benefits of a lower processing temperature and the adoption of more conductive materials.…”

Section: Introductionmentioning

confidence: 99%

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Li¹,

Lin²,

Chen³

et al. 2014

Materials Science and Engineering: A

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“…Considering the low melting temperature of lead-free solders, silver sintering seems a promising replacement for operation at elevated thermal cycling amplitudes. Higher thermal and electrical conductivities and improved thermo-mechanical reliability have been obtained recently for sintered silver paste [4][5][6].…”

Section: Introductionmentioning

confidence: 99%

“…On the other hand, the applied pressure can create defects and cracks in the chips and substrate. A remarkable step forwards was obtained by decreasing the size of initial silver particles from the micron to the nanometer range [4][5][6][8][9][10][11][12]. Low-temperature bonding (LTB) by sintering nano-sized silver paste is now emerging as a potential lead-free die-attach solution for power electronics modules.…”

Section: Introductionmentioning

confidence: 99%

Deformation behavior of sintered nanocrystalline silver layers

et al. 2015

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Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

Cited by 161 publications

References 34 publications

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Deformation behavior of sintered nanocrystalline silver layers

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