Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Li, Wenhua; Lin, Pei-Syuan; Chen, Chen-Ni; Dong, Tungalag; Tsai, Chi-Hang; Kung, Wan-Ting; Song, Jenn‐Ming; Chiu, Ying-Ta; Yang, Ping-Feng

doi:10.1016/j.msea.2014.07.002

Cited by 30 publications

(13 citation statements)

References 43 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Presently, various solvents, such as ethanol and ethylene glycol, methanol, toluene, , and isopropanol, have been used to remove the dispersant and reduce the required sintering temperature close to room temperature. Utilization of weakly binding organics or easily decomposable organics ,, on the NP surface could also attain this aim.…”

Section: Microstructures and Mechanical Properties Of Silver Joints V...mentioning

confidence: 99%

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng¹,

Gerlich³

et al. 2015

ACS Appl. Mater. Interfaces

294

121

View full text Add to dashboard Cite

A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.

show abstract

Section: Microstructures and Mechanical Properties Of Silver Joints V...mentioning

confidence: 99%

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng¹,

Gerlich³

et al. 2015

ACS Appl. Mater. Interfaces

294

121

View full text Add to dashboard Cite

show abstract

“…Moreover, cracks frequently occur between the plating layers and the Cu layer and then reduce the bonding strength of the joints . Currently, chip bonding on a bare copper substrate has become a hot topic. − To realize chip bonding on a bare copper substrate, the oxidation of the connection material and Cu substrate should be avoided. For example, some researchers have achieved direct Cu bonding joints in reductive gas (H 2 or formic acid steam) or inert atmosphere (Ar or N 2 ) .…”

Section: Introductionmentioning

confidence: 99%

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu₃Sn Paste for High-Power Electronics Packaging

Guo

Liu

et al. 2022

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

In this work, a multiscale coralloid nano-Cu3Sn composed of a bimodal structure (∼55 and ∼120 nm) has been successfully synthesized to meet low-cost and Pb-free packaging demands for high-power electronic application. Owing to the excellent oxidation resistance of the Cu3Sn intermetallic compounds (IMCs) and the protection of solvent poly(ethylene glycol)-400 (PEG-400) at high temperature, the full-Cu3Sn joints sintered in air have a comparative shear strength with the joints acquired in vacuum when the sintering temperature is no more than 300 °C. The full-Cu3Sn joints acquired at 300 °C in air achieve a high bonding strength of 40.4 MPa, which is superior to those of traditional Sn-based solder joints (19 MPa) and full-Cu6Sn5 joints (17.7 MPa). The electrical resistivity of the sintered Cu3Sn films reaches 29.1 μΩ·cm in air. Cu3.02Sn0.98 is formed at the interface between the Cu substrate and sintered Cu3Sn layer, contributing to the exceptional bonding strength of the full-Cu3Sn joints. The bonding strength of the joints after high-temperature storage (HTS) tests reveals that the prepared full-Cu3Sn joints possess outstanding long-term thermal stability with a shear strength of 47.9 MPa after 800 h of storage at 250 °C. Our work breaks through the synthesis bottleneck of nano-Cu3Sn IMCs and provides the underlying insights needed to guide the design of highly stable full-IMC joints for high-temperature electronic packaging.

show abstract

“…Usually, the adhesive for the 3D IC junction can be conventional tin–lead solder, lead-free solder, or a silver paste. The silver paste has higher bond strength, better conductivity, and excellent high temperature service performance compared to the conventional solders [ 7 , 8 , 9 ]. Due to these reasons, silver paste is a good adhesive candidate for reducing current consumption and lowering heat caused by resistance [ 10 , 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

Hsu

Chen

et al. 2021

Materials

View full text Add to dashboard Cite

A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω∙m, and the shear strength was 57.48 MPa.

show abstract

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Cited by 30 publications

References 43 publications

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu₃Sn Paste for High-Power Electronics Packaging

Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

Contact Info

Product

Resources

About

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Cited by 30 publications

References 43 publications

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu3Sn Paste for High-Power Electronics Packaging

Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate

Contact Info

Product

Resources

About

Robust Cu–Cu Bonding with Multiscale Coralloid Nano-Cu₃Sn Paste for High-Power Electronics Packaging