Review—On Atomic Layer Deposition: Current Progress and Future Challenges

Abstract

Atomic layer deposition (ALD) relies on self-limiting reaction within a cyclic process and is being considered as a potential technique for synthesizing nanomaterials with precisely controlled internal structure. Therefore, the design and synthesis of advanced ultrafine nanomaterials becomes feasible through a rigorous control over the morphology, micro-and nano-structure, composition, thickness and particle size. Currently, ALD is mostly adopted for semiconductor applications; however, several other areas (i.e. catalysis and energy storage) can hugely benefit from ALD capabilities if the process is finely tuned. In this review paper, significant previous works on ALD of nanomaterials have been discussed via focusing on the deposition of noble metals, metal oxides, two-dimensional materials and metal-organic frameworks on various substrates. Major contributing parameters (e.g. deposition temperature, ALD cycles, and type of the precursor) affecting the deposition process have also been covered. The review concludes with a summary of opportunities for future research to enable large-scale implementation of ALD as a reliable and robust technique for synthesizing nanomaterials.

Electrochemical Zinc Ion Capacitors: Fundamentals, Materials, and Systems

“…To minimize the impedance values, the thickness of the coating layers can be controlled by thin‐film synthesis techniques such as chemical vapor deposition [ 246 ] and atomic layer deposition. [ 247 ]…”

Review on process-microstructure-performance relationship in ALD-engineered SOFCs

“…Additionally, a successful industrial-level ALD system is required for applying ALD to SOFC fabrication with reasonable cost-effectiveness. Recently, various ALD strategies, such as batch ALD, roll-to-roll ALD, spatial ALD, and atmospheric pressure ALD, are being actively researched to improve throughput while retaining unique advantages of ALD process [86,154]. Only after such considerations, investigations on the applicability of ALD to SOFCs could have useful practical consequences, advancing beyond the laboratory scale to the prototyping level.…”

Controllable atomic layer deposition coatings to boost the performance of LiMnxCoyNi1−x−yO2 in lithium-ion batteries: A review

“…Afterwards, ML was developed by Professors Aleskovskii and Koltsov from the USSR Academy of Sciences [54], where metal oxides were deposited using alternating exposure of metal chloride precursors and water. Several conference papers from the early 1960s described TiO 2 and GeO 2 ML, but these studies were overlooked by researchers from outside the Soviet Union because they were published only in Russian [55]. In Japan, the ALD process was called molecular layer epitaxy.…”