2021
DOI: 10.3390/nano11102556
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Review of Si-Based GeSn CVD Growth and Optoelectronic Applications

Abstract: GeSn alloys have already attracted extensive attention due to their excellent properties and wide-ranging electronic and optoelectronic applications. Both theoretical and experimental results have shown that direct bandgap GeSn alloys are preferable for Si-based, high-efficiency light source applications. For the abovementioned purposes, molecular beam epitaxy (MBE), physical vapour deposition (PVD), and chemical vapor deposition (CVD) technologies have been extensively explored to grow high-quality GeSn alloy… Show more

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Cited by 54 publications
(21 citation statements)
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“…On the other hand, for Si-based OEIC, the Si-based light source is the ultimate obstacle to achieve owing to the fact that Si is an indirect band-gap semiconductor material, and its emission efficiency is very low, which makes it unavailable as the active gain medium for Si-based high-efficient light sources. In contrast, most group III-V materials are definitely suitable for the optoelectronic devices in light-emitting/absorbing devices, including light-emitting diodes (LEDs), lasers, and detectors [ 11 , 12 , 13 , 14 ], owing to their direct bandgap properties, indicating their stronger photon emission and absorption efficiency in comparison than indirect semiconductors such as Si, Ge [ 15 , 16 ], and GeSn [ 17 ]. Thus, taking advantage of the excellent properties of III-V compounds, Si-based III-V CMOS devices and III-V photoelectric devices can further greatly improve the data transmission speed and amount, which effectively reduce integrated electricity and power consumption [ 18 ].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, for Si-based OEIC, the Si-based light source is the ultimate obstacle to achieve owing to the fact that Si is an indirect band-gap semiconductor material, and its emission efficiency is very low, which makes it unavailable as the active gain medium for Si-based high-efficient light sources. In contrast, most group III-V materials are definitely suitable for the optoelectronic devices in light-emitting/absorbing devices, including light-emitting diodes (LEDs), lasers, and detectors [ 11 , 12 , 13 , 14 ], owing to their direct bandgap properties, indicating their stronger photon emission and absorption efficiency in comparison than indirect semiconductors such as Si, Ge [ 15 , 16 ], and GeSn [ 17 ]. Thus, taking advantage of the excellent properties of III-V compounds, Si-based III-V CMOS devices and III-V photoelectric devices can further greatly improve the data transmission speed and amount, which effectively reduce integrated electricity and power consumption [ 18 ].…”
Section: Introductionmentioning
confidence: 99%
“…GeSn has aroused extensive attention as a result of its direct bandgap properties [ 1 ], compatibility with Si CMOS processes [ 2 , 3 , 4 , 5 , 6 ], higher absorption coefficients at short-wavelength infrared (SWIR) windows [ 7 ], and higher carrier mobilities compared with Si and Ge, etc. [ 3 ].…”
Section: Introductionmentioning
confidence: 99%
“…According to the different detection objects, it can be divided into five bands: near infrared (NIR), short-wave infrared (SWIR), mid-wave infrared (MWIR), long-wave infrared (LWIR) and far infrared (FIR). The most common detectors in several wave bands are silicon PDs for NIR [6], InGaAs and GeSn PDs for SWIR [7,8], HgCdTe PDs and InSb PDs for MWIR [9,10], and quantum-well infrared photodetectors (QWIPs), quantum cascade photodetectors (QCDs), as well as type II superlattice photodetectors for LWIR [11,12]. Note that the family of photodetectors in NIR to MWIR is very large, and a variety of alternative plans [13,14] for InGaAs and HgCdTe have been proposed.…”
Section: Introductionmentioning
confidence: 99%