Review of Micro/Nano Nondestructive Evaluation Technique (I): Surface and Subsurface Investigation

Abstract

The present paper reviews the widely used surface microstructural investigation technique and micro/nano nondestructive evaluation(NDE) technique which is able to evaluate the surface and subsurface. In general, the micro/nano defects and microstructural state of surface have great influence on the mechanical, physical, and chemical properties of bulk materials. The investigation technique of surface microstructure is possible to evaluate the defects and microstructural state with high reliability. The various applications and developments of each inspection technique have been introduced. Consequently, it is thought that the technique developments and applications of micro/nano NDE in nondestructive industries are extensively possible hereafter.

Thickness Measurement of Aluminum Thin Film using Dispersion Characteristic of Surface Acoustic Wave

“…In recent years, nano-structured thin film systems are often applied in industries (e.g., MEMS/NEMS device, semiconductor, display, optical coating or the like). Thin film are used for many and varied purpose to provide resistance to abrasion, erosion, corrosion, galling, tarnish, wear, radiation damage, or high temperature oxidation and to reduce friction or electrical resistance, provide lubrication, prevent sticking, and also to provide special magnetic or dielectric properties [1][2][3][4].…”

Simulation of Excitation and Propagation of Pico-Second Ultrasound

“…The growing importance of electromechanical microstructures (MEMS) requires a rapid characterization during and after fabrication. Many different methods such as scanning electron microscopy (SEM) and tunneling electron microscopy (TEM) techniques provide data of roughness and surface quality and of electrical and optical properties [1]. However, the mechanical quantities are measured mostly by destructive techniques such as nano-indentation, even though it is one of key parameters for manufacturing processes and conditions in the micro-devices and performance of thin films.…”

“…Since the thickness of films and coatings significantly influence the resulting mechanical properties, non-destructive measurement techniques are necessary, which can provide mechanical properties of coatings or microstructures after fabrication. Recently few nondestructive testing methods including GHz scanning electronic acoustic microscopy (SAM) and ultrasonic atomic force microscopy (UAFM) techniques were introduced and applied to MEMS [1]. In these technologies, surface waves or Lamb waves are generated on thin films via acoustic lens and micro-structured cantilever for measurement of mechanical properties of thin films.…”