Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
Yuan Chen,
Zhongyang Wang,
Yuhui Fan
et al.
Abstract:In a highly competitive and demanding microelectronics market, non-destructive testing (NDT) technology has been widely applied to defect detection and evaluation of microelectronic packaging. However, the trend of microelectronic packaging toward miniaturization, high-density, ultra-thin, ultra-light and with small chip footprint, poses an urgent demand for novel NDT methods with high-resolution and large penetration depth, which is utilized for internal defect detection and identification of advanced complic… Show more
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