Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses

Tsai, Tsung-Yueh; Yeh, Chang-Lin; Lai, Yi‐Shao; Chen, Rongsheng

doi:10.1016/j.microrel.2006.07.096

Cited by 18 publications

(5 citation statements)

References 9 publications

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“…It should be noted that ''Base Excitation" is the basic solution technique in another commercial solver, ABAQUS/ Standard. Indeed, the drop-shock event is simple enough to be modelled analytically as was attempted by Mindlin [63] of Bell, Suhir [64] of Lucent, Wong [25] of IME, and Tsai et al [65] of ASE. Analytical solutions for spring-mass systems subjected to a half-sine shock pulse were provided by Mindlin, Wong, and Tsai et al, while Suhir and Wong provided the solutions for a PCB modelled as a beam and as a plate, respectively.…”

Section: Modeling and Simulationmentioning

confidence: 99%

A review of board level solder joints for mobile applications

Wong

Seah

Shim

2008

Microelectronics Reliability

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Section: Modeling and Simulationmentioning

confidence: 99%

A review of board level solder joints for mobile applications

Wong

Seah

Shim

2008

Microelectronics Reliability

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“…According to the support excitation scheme [4,5] and equation 1, the impact force is translated into effective excitation load and the damp coefficient is assumed as zero, therefore the vibration equation of PCB drop system can be described as equation 2: (2) Where m, k, , are mass, spring coefficient, acceleration and displacement of PCB assembly, respectively.…”

Section: Drop Vibration Equation Of Simple Pcb Assemblymentioning

confidence: 99%

Drop Dynamic Responses and Modal Analysis for Board Level TFBGA

Pan

Zhou

Yan

2007

High Density Design Packaging and Microsystem Integration, 2007 International Symposium On

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Along with more and more use of thin-profile fine-pitch ball grid array (TFBGA) in portable electronic products, such as mobile phones and personal digital assistant (PDA), etc., the drop impact reliability of solder joints for TFBGA becomes a critical concern. This problem is more serious with the application of lead free solder because lead free solder alloy have higher rigidity and lower ductibility compared with the traditional SnPb solder alloy. Whereas the drop test is high cost and long cycle, and the traditional board level drop simulation poses severe challenge to the computer resource, the theory analysis and modal superposition method are combined in this paper. Firstly, the drop vibration differential equation of simplified PCB assembly is deduced and the analytic solution is solved based on the given boundary condition according to the dynamics theory. Secondly, the ANSYS/LS-DYNA software is employed, a quarter 3D model with 15 representatives lead free TFBGA mounted on PCB is developed, and the dynamic responses of solder joint is analyzed under the drop impact. The critical solder joint with the maximal stress caused by deflection of PCB is identified by the model. Finally, the relationship between the number of screws which support the PCB and the PCB deflection under drop impact is studied through the modal superposition, and the influence of every stage mode to the PCB bending deflection is discussed. The results show that the outermost corner solder joint called critical solder joint is aptest to failure. More deflection of PCB causes larger stress of solder joint. The first bend mode is the main factor which influences the bending deflection of PCB. Adopting more screws to support PCB as well as reducing the influence of the first mode is good to improve the drop impact performance of solder joint. Compared with time history explicit dynamic analysis, modal superposition harmonic response analysis can save the solving time greatly.

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“…In order to understand structural responses and failure mechanisms of the board-level test vehicle subjected to JEDEC or other pulse-controlled drop test methodologies alike, numerous theoretical (e.g., [5][6][7][8]), experimental (e.g., [9][10][11][12][13]), and numerical studies (e.g., [13][14][15][16][17][18][19][20]) have been conducted. Most of these studies focused on a single test condition only.…”

Section: Introductionmentioning

confidence: 99%