2016
DOI: 10.1016/j.physb.2015.08.014
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Response of Ni/4H-SiC Schottky barrier diodes to alpha-particle irradiation at different fluences

Abstract: Irradiation experiments have been carried out on 1.9 × 10 16 cm -3 nitrogen-doped 4H-SiC at room temperature using 5.4 MeV alpha-particle irradiation over a fluence ranges from 2.6 × 10 10 to 9.2 × 10 11 cm -2 . Current-voltage (I-V), capacitance-voltage (C-V) and deep level transient spectroscopy (DLTS) measurements have been carried out to study the change in characteristics of the devices and free carrier removal rate due to alpha-particle irradiation,

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Cited by 16 publications
(16 citation statements)
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“…This value is consistent with carrier removal rate values of 6.5 × 10 3 –4 × 10 4 cm −1 reported in the literature for n‐type 4H‐SiC. [ 40–42 ] The model also predicts that the defect center ( N def ) that forms the second ionization energy ( E def ) is a shallow acceptor with an ionization energy of 0.12–0.13 eV. It is possible that the irradiation induces a shallow acceptor to form, as was found by Reshanov et al, [ 43 ] where a 0.15–0.18 eV acceptor‐like level was found in Al‐doped 6H‐SiC after H + and He + implantation.…”
Section: Resultssupporting
confidence: 88%
“…This value is consistent with carrier removal rate values of 6.5 × 10 3 –4 × 10 4 cm −1 reported in the literature for n‐type 4H‐SiC. [ 40–42 ] The model also predicts that the defect center ( N def ) that forms the second ionization energy ( E def ) is a shallow acceptor with an ionization energy of 0.12–0.13 eV. It is possible that the irradiation induces a shallow acceptor to form, as was found by Reshanov et al, [ 43 ] where a 0.15–0.18 eV acceptor‐like level was found in Al‐doped 6H‐SiC after H + and He + implantation.…”
Section: Resultssupporting
confidence: 88%
“…At higher forward bias (i.e., >0.75 V), the characteristics of both diodes (pristine and selectively irradiated) would dominate by the series resistance . On the other hand, the conventional way irradiated SBDs show totally degraded forward bias characteristics which may be ascribed to the buried layer of defects in the reference/target material . The performance of conventionally irradiated SiC SBDs gives information about their radiation hardness capability.…”
Section: Resultsmentioning
confidence: 99%
“…In Table , the calculated values of BH, IF, and reverse leakage current densities reveals that used shadow mask process and quality of the devices seems good . The cause for observed non‐ideality in both SBDs may be due to quantum mechanical tunneling (QMT), field emission (FE), thermionic field emission (TFE), barrier height inhomogeneties, defects etc .…”
Section: Resultsmentioning
confidence: 99%
“…Samples were cut into smaller sizes from the wafer. Before metallization of the ohmic contact on highly doped side (1.0 × 10 18 cm -3 ) of the sample, the degreasing and etching were carried out as described in refs [8,12,15,16]. Nickel ohmic contacts of 300 nm in thickness were thermally evaporated at a deposition rate of ~0.09 nm s −1 and vacuum pressure of ~2×10 -5 mbar.…”
Section: Methodsmentioning
confidence: 99%
“…The ohmic contacts were annealed in a quartz tube heated by a Linderberg Hevi-Duty furnace in flowing Ar at 950 °C for 10 minutes to reduce the contact (metalsemiconductor) resistance by the forming of nickel silicide. Prior to Schottky contact evaporation on the front (epi-layer) side of the samples, the samples were degreased as reported in refs [8,12,15,16]. Au/Ni Schottky contacts, 0.6 mm in diameter with a thickness of 200/800 nm, were thermally evaporated through a metal contact mask at very low deposition rate of ~0.02 nm s −1 and vacuum pressure of ~1×10 -5 mbar.…”
Section: Methodsmentioning
confidence: 99%