2019
DOI: 10.1063/1.5082895
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Resonant cavity enhanced photodiodes on GaSb for the mid-wave infrared

Abstract: We report the design, growth, processing, and characterization of resonant cavity enhanced photodiodes for the midwave infrared at ∼3.72 μm on GaSb. Using AlAsSb/GaSb mirrors, AlAsSb barrier and spacer layers and a thin 96 nm InAsSb absorber, we observed dark current and detectivity behavior superior to common InAsSb nBn detectors in the literature, with peak specific detectivity values of 8×1010 and 1×1010 cm Hz1/2 W−1 measured at 250 K and 300 K, respectively. In the same temperature range, the linewidth of … Show more

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Cited by 21 publications
(13 citation statements)
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“…[ 8 ] However, the MWIR has seen the most effort. [ 9–12 ] RCE–PDs grown on GaSb substrates have become well established, whereas for the target of 3 μ m , a lattice‐mismatched RCE–PD was grown on a GaAs substrate by Green et al [ 13 ] RCE–PDs on InAs substrates have also been touched upon by O’Loughlin et al [ 11 ]…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[ 8 ] However, the MWIR has seen the most effort. [ 9–12 ] RCE–PDs grown on GaSb substrates have become well established, whereas for the target of 3 μ m , a lattice‐mismatched RCE–PD was grown on a GaAs substrate by Green et al [ 13 ] RCE–PDs on InAs substrates have also been touched upon by O’Loughlin et al [ 11 ]…”
Section: Introductionmentioning
confidence: 99%
“…Use of an InAs substrate allows for native use of the InAs binary absorber material, with minimal defects and dark currents, as well as sensitivity at 3.3 μ m . Previous work has demonstrated an RCE–PD utilizing an InAs 0.91 Sb 0.09 absorber on a GaSb substrate [ 10 ] that could also be adjusted to sense at 3.3 μ m . This Letter analyses the performance of the InAs‐based RCE–PD and offers comparisons with the InAsSb‐based RCE–PD where reasonable.…”
Section: Introductionmentioning
confidence: 99%
“…The photonic structures integrated with infrared detection materials are able to increase the effective light–matter interaction length and producing an intensified local field at the infrared detection material while keeping the material in a small volume. [ 13–16 ] Moreover, the photonic structures integrated with infrared detection materials can adjust the light coupling condition to a critical coupling status, where the reflection is zero and all the incident power is absorbed by the system. When anisotropic photonic structures are integrated with infrared detection materials, polarization detection with high extinction ratio can be achieved.…”
Section: Introductionmentioning
confidence: 99%
“…But III-V semiconductors do provide advantages such as high electron mobilities, superior optoelectronic properties and a greater degree of bandgap engineering, making them the preferred material for LEDs, laser diodes, infrared detectors, power and RF transistors and high electron mobility transistors. [5][6][7][8] Therefore, the integration of the complementary technologies of III-Vs and Si is highly desirable for many applications. [9] This has historically been carried out by wafer bonding techniques, but such approaches have drawbacks such as added complexity of fabrication and differences of wafer size, often resulting in inefficient use of substrate material.…”
Section: Introductionmentioning
confidence: 99%