1995
DOI: 10.1063/1.114835
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Resistless high resolution optical lithography on silicon

Abstract: Method for fabricating submicron silicide structures on silicon using a resistless electron beam lithography process Appl.

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Cited by 33 publications
(17 citation statements)
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“…With a scanning speed of 80 m/s, and assuming an effective illumination area of 1 m in diameter, the maximum illumination dose reaches 40 kJ/cm 2 which is sufficient for hydrogen desorption. 9 Figure 3 shows an AFM image of two slightly displaced scan lines after the KOH etch. Each line scan has a profile consisting of three peaks, a narrow central peak, and two slightly broader side peaks.…”
Section: A Lithography With Uncoated Fiber Probesmentioning
confidence: 99%
See 1 more Smart Citation
“…With a scanning speed of 80 m/s, and assuming an effective illumination area of 1 m in diameter, the maximum illumination dose reaches 40 kJ/cm 2 which is sufficient for hydrogen desorption. 9 Figure 3 shows an AFM image of two slightly displaced scan lines after the KOH etch. Each line scan has a profile consisting of three peaks, a narrow central peak, and two slightly broader side peaks.…”
Section: A Lithography With Uncoated Fiber Probesmentioning
confidence: 99%
“…4,8 More recently, optically induced hydrogen desorption was reported. [9][10][11] In this article we discuss results obtained using a scanning near-field optical microscope ͑SNOM͒ 12 to generate an oxide mask on an amorphous silicon ͑a-Si͒ layer. Results for uncoated fiber probes are compared with those for aluminum-coated probes.…”
Section: Introductionmentioning
confidence: 99%
“…We use a laser direct write system [11] and an AFM to locally oxidize a hydrogen-passivated amorphous silicon surface. Kramer et al [12] have recently achieved linewidths of 200 nm on hydrogen-passivated crystalline silicon by letting two interfering UV-laser beams (λ = 350.7 nm) illuminate the surface for 15 min with a power of 150 mW. By using laser direct writing for local oxidation of a hydrogen-passivated amorphous silicon surface, we have achieved linewidths down to 500 nm with writing speeds up to 100 mm s −1 [13].…”
Section: Introductionmentioning
confidence: 99%
“…This wavelength matches approximately the Si-H binding energy of ϳ3 eV. 17 Directly written optically induced lines down to 110 nm in width have been measured after exposure and potassium hydroxide ͑KOH͒ etch. Further, linewidths of 50 nm have been observed without light exposure, probably produced by an electrostatic potential between the fiber probe and the amorphous silicon layer.…”
Section: Optical Near-field Lithography On Hydrogen-passivated Silicomentioning
confidence: 99%
“…This technique has been introduced using STM, 9-13 AFM, 14,15 and electron beam lithography. 12,16 Kramer et al 17 have recently reported on a purely optically induced oxidation. An optical interference pattern ͑ϭ350.7 nm͒ has been projected onto a hydrogen-passivated silicon surface, which produces submicrometer lines after etching.…”
Section: Optical Near-field Lithography On Hydrogen-passivated Silicomentioning
confidence: 99%