Resistivity and microstructure of polycrystalline Au films deposited by rf bias-diode and triode sputtering

Cornely, R. H.; Ali, Tayyeb

doi:10.1063/1.325370

Cited by 15 publications

(2 citation statements)

References 9 publications

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“…Detailed modeling of the conductivity of sputtered gold is difficult without knowing its polycrystalline structure. However, previous work [35] suggests that the conductivity of a 20 nm sputtered gold film will be 5-10 orders of magnitude less than that of the bulk metal, which has a typical conductivity of 4.5-5.0 × 10 7 S m -1…”

Section: Methodsmentioning

confidence: 97%

Electric‐Field‐Assisted Alignment of Supramolecular Fibers

et al. 2006

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A molecular wire consisting of a metal/molecule/metal junction can be regarded as the basic building block for future nanoelectronics applications. Alongside the great effort expended in the last ten years on the use of single molecules as electroactive components, [1][2][3] there is also a growing interest centered on the use of supramolecular architectures as electroactive species to bridge metallic electrodes.[4] The supramolecular approach can enhance the mechanical and electronic properties of the wire, which should improve the performance of electronic devices.[ [5][6][7][8][9][10] One major challenge in the study of charge transfer across organic molecules is achieving reproducible attachment between metallic electrodes. Although different electrode pairs have been employed, including break junctions, [3] lithographically tailored nanoelectrodes, [11] and a solid substrate and a conductive tip of an atomic force microscope [12][13][14] or a mercury drop, [15] new, scalable routes to the controlled incorporation of nanometer-scale objects in the gap between nanoelectrodes are required. The manipulation and alignment of an anisotropic object using dielectrophoretic forces in an electric field has been successfully accomplished with a variety of different structures including metal and semiconducting nanoparticles [11] and nanowires, [16] DNA molecules, [17] carbon nanotubes, [18,19] block copolymers, [20] ZnO-organic complexes, [21] and dendron rod-coil ribbons. [22] This has recently led, for example, to improved emission properties of single conjugated polymer molecules.[23] The possibility of applying this technique to supramolecularly engineered nanostructures is thus of major interest in view of their reversible self-assembling properties under external stimuli such as temperature and chemical environment. [24] We provide here the first direct quantitative determination of the electric-field-assisted alignment of single organic supramolecular fibers self-assembled at a surface. We have chosen a gel-forming functionalized 1,3,5-triamide cis,cis-cyclohexane derivative (cyclohexane trisamide gelator (CTG), Fig. 1a) that is known to self-assemble into supramolecular fibers in aqueous solution through the formation of hydrogen bonds. [25,26] Due to its wider applicability for electronic applications, we present here attempts to form similar fibers in an organic solvent. Fibers were deposited from solution onto two gold electrodes arranged in a source-drain geometry with micrometer-scale separation. During deposition, a DC voltage was applied between the two electrodes and the system was cooled below its sol-gel transition temperature (T sol-gel ).In the gel, the three intermolecular hydrogen bonds among the amide moieties of CTGs are both parallel to one another and perpendicular to the plane of the cyclohexane ring (see Fig. 1a inset), endowing strong, self-complementary, and uniaxial intermolecular interactions that are necessary to enforce quasi-1D self-assembly.[27] Since each hydrogen bond has a dipolar...

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Section: Methodsmentioning

confidence: 97%

Electric‐Field‐Assisted Alignment of Supramolecular Fibers

et al. 2006

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“…REVUE DE PHYSIQUE APPLIQUÉE TOME 1. Introduction. -In the recent years it has been observed that evaporated [1][2][3][4] and sputtered [5][6][7][8][9] thin metal films exhibit a fine grained structure and thus grain-boundary scattering can significantly dominates the electromechanical properties of these films [10][11][12][13]. Mayadas and Shatzkes [14] have taken into account the grain boundary scattering and have proposed a conduction model [14] which describes the combined effects of grain-boundary, external surfaces and background scatterings.…”

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confidence: 99%

Linearization of polycrystalline film gauge factors

Pichard¹,

Tellier²

1979

Rev. Phys. Appl. (Paris)

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A linearized equation is proposed to describe the thickness dependence of the polycrystalline film gauge factor γF. Finally the theoretical variation of γF is represented by a general equation whose form is similar to those related to linearized equations previously derived for analyzing polycrystalline film resistivity and T.C.R. Comparisons of exact and approximate values indicate a deviation less than 10 % over large ranges of the surface scattering specularity parameter, p, the average random distance between grain boundaries, ag, and the ratio, k, of the film thickness to background mean free path

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