2021
DOI: 10.1039/d0nr07002e
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Resistive crack-based nanoparticle strain sensors with extreme sensitivity and adjustable gauge factor, made on flexible substrates

Abstract: In this paper, we report the demonstration of highly sensitive flexible strain sensors formed by a network of metallic nanoparticles (NPs) grown under vacuum on top of a cracked thin alumina film which has been deposited by atomic layer deposition.

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Cited by 46 publications
(62 citation statements)
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“…[ 36–39 ] Owing to high sensitivity at room temperature and flexibility, crack‐based strain sensor exhibits a promising aspect in flexible electronic and intelligent systems. [ 40–45 ] In 2014, inspired by crack‐shaped organs of spider, Zhao et al., first reported a crack‐based strain sensor with ultrahigh gauge factor of 2000 at 2% strain. [ 39 ] Although remarkable progress has been made in this field, current crack sensors are used in tactile sensing and there are few reports for crack sensor with non‐contact sensing and magnetic respond properties.…”
Section: Introductionmentioning
confidence: 99%
“…[ 36–39 ] Owing to high sensitivity at room temperature and flexibility, crack‐based strain sensor exhibits a promising aspect in flexible electronic and intelligent systems. [ 40–45 ] In 2014, inspired by crack‐shaped organs of spider, Zhao et al., first reported a crack‐based strain sensor with ultrahigh gauge factor of 2000 at 2% strain. [ 39 ] Although remarkable progress has been made in this field, current crack sensors are used in tactile sensing and there are few reports for crack sensor with non‐contact sensing and magnetic respond properties.…”
Section: Introductionmentioning
confidence: 99%
“…In particular sensors with a 20nm thick alumina film show a GF of 7998 for strains up to 4.17% and a colossal GF of 2.6x10 8 for strain up to 7.2% (Fig. 5.11c), which is the highest sensitivity that has ever been reported [48]. The performance of the sensor can be better understood if the SEM images of Fig.…”
Section: Dense Np Sensormentioning
confidence: 90%
“…Last but not least, the devices are cost competitive since they are produced using processing steps like ALD and sputtering which are compatible with batch fabrication. This work was published in the scientific journal Nanoscale [48].…”
Section: Discussionmentioning
confidence: 99%
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