Extreme ultraviolet chemically amplified resist performance has recently been extended to the 15-nm half pitch regime, yet line-edge roughness (LER) remains far from targets. Stochastic analysis, however, shows current LER performance to be material limited rather than photon limited.Interest in contact hole printing and contact size uniformity has dramatically increased over the past few years. As with line space printing, we find contact uniformity performance to be material limited rather than photon limited. Nevertheless, current resist parameters would lead to the photon noise alone exceeding the uniformity requirement by the 16-nm half pitch node with conventional masks. The use of phase shift masks is shown to provide a significant benefit. Combining phase shift masks with relatively modest improvements in resist is predicted to lead to target performance down to 12-nm half pitch and beyond.