Residual stress measurements with laser speckle correlation interferometry and local heat treating

Pechersky, Martin J.; Miller, Robert F.; Vikram, Chandra S.

doi:10.1117/12.210762

Cited by 43 publications

(22 citation statements)

References 1 publication

(1 reference statement)

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“…The application of local heating for releasing the residual stress combined with DSPI for measuring the in-plane displacement component was recently presented by Perchersky et al 13,14 Using preloaded test specimens under uniaxial tension and a simple theoretical model to explain the annealing process, through a series of experiments these authors demonstrated the validity of this approach for releasing residual stresses. As the loading direction was known, a standard dual-beam interferometer with a sensitivity along that direction was used in these works.…”

Section: Introductionmentioning

confidence: 99%

“…If the material is heated too much or too fast, the local thermal expansion will create plastic compressive strains. 13 Therefore, there would be two types of strains: one due to the residual stress relaxation and the other due to the induced plastic compressive deformation which would introduce significant errors in the measurements of the residual stresses. They can be avoided by using an appropriate heating cycle.…”

Section: Experimental Setup and Testing Proceduresmentioning

confidence: 99%

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Residual stress measurement using a radial in-plane speckle interferometer and laser annealing: preliminary results

et al. 2003

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This paper presents a combined system based on digital speckle pattern interferometry and laser annealing to determine residual stresses in ductile materials. The system allows the measurement of the radial in-plane displacement field generated when a specimen subjected to residual stresses is locally heated. This novel approach for measuring residual stresses has the advantage of being nondestructive and can be easily applied to in situ tests. The description of the combined system is followed by the presentation of preliminary results which illustrate the ability of both techniques to identify residual stress fields and also to determine their principal directions.

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Section: Introductionmentioning

confidence: 99%

Section: Experimental Setup and Testing Proceduresmentioning

confidence: 99%

Residual stress measurement using a radial in-plane speckle interferometer and laser annealing: preliminary results

et al. 2003

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“…8,9 Because flexible substrates on which thin films are fabricated are affected by the stress associated with the fabrication process, the measurement and analysis of thin-film stress are crucial for fabricating and developing flexible electronic devices. Furthermore, in flexible substrates coated with a noncrystalline thin film, the thin-film stress can cause large deformations, and, therefore, conventional testing techniques, such as optical interferometry [10][11][12][13] and x-ray diffraction method, 14,15 cannot be used. The moiré method involves a large measurement depth, high stability, and a simple and economical optical configuration, and, therefore, it is considered appropriate for the stress measurement of thin films on flexible substrates.…”

Section: Introductionmentioning

confidence: 99%

Stress measurement of thin film on flexible substrate by using projection moiré method and heterodyne interferometry

Chen

Tseng

et al. 2016

Opt. Eng

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, "Stress measurement of thin film on flexible substrate by using projection moiré method and heterodyne interferometry," Opt. Eng. 55(6), 064102 (2016), doi: 10.1117/1.OE.55.6.064102. Abstract. We propose a stress measurement system based on a projection moiré method and heterodyne interferometry for thin films on a flexible substrate. In the measurement setup, a CMOS camera in which every pixel can receive a series of heterodyne moiré signals by using a continuously relative displacement with a constant velocity is used. Furthermore, the phase of the optimized sinusoidal curve and the surface profile of the flexible substrate are determined using a least-squares sine fitting algorithm. The thin-film stress is obtained by representing the cross-sectional curve of the surface profile by using a polynomial fitting method, estimating the resultant curvature radii of the uncoated and coated substrates, and using these two radii in the corrected Stoney formula. The proposed measurement system has the advantages of high accuracy, high resolution, and high capacity for substrates with high flexibility and a large measurement depth. © The Authors. Published by SPIE under a Creative Commons Attribution 3.0 Unported License. Distribution or reproduction of this work in whole or in part requires full attribution of the original publication, including its DOI.

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“…In fact, in the stress measurement problems, we have found that fringe counting along a line yields enough quantitative data. 6,8,10 In this paper, we present the design aspects of such a prism with some experimental results. Besides the current need of the sign determination, the approach should also be useful in spatial phase shifting interferometry.…”

Section: Introductionmentioning

confidence: 99%

“…In our particular interest, we have successfully demonstrated that local spot heating and subsequent surface strain measurements by speckle correlation interferometry can provide quantitative information about the object stress. [6][7][8][9][10][11] Recently Zhang 12 applied speckle correlation interferometry to determine surface strains induced by blind-hole-drilling procedure of the residual stress evaluation. All these experiments have been in laboratory conditions with samples under known stress situations.…”

Section: Introductionmentioning

confidence: 99%

Wedge prism for direction resolved speckle correlation interferometry

Vikram

Pechersky

1999

Opt. Eng

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Abstract. The role of a wedge prism for strain sign determination and enhancing the sensitivity for sub-fringe changes is emphasized. The design and incorporation aspects for in-plane sensitive interferometers have been described in detail. Some experimental results dealing with stress determination by laser annealing and speckle correlation interferometry are presented. The prism can also be applied to produce standardized carrier fringes in spatial phase shifting interferometry.

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Residual stress measurements with laser speckle correlation interferometry and local heat treating

Cited by 43 publications

References 1 publication

Residual stress measurement using a radial in-plane speckle interferometer and laser annealing: preliminary results

Residual stress measurement using a radial in-plane speckle interferometer and laser annealing: preliminary results

Stress measurement of thin film on flexible substrate by using projection moiré method and heterodyne interferometry

Wedge prism for direction resolved speckle correlation interferometry

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