2020
DOI: 10.1007/s10909-020-02497-0
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Research Progress of Thermal Contact Resistance

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Cited by 21 publications
(4 citation statements)
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“…Referring to the previous argument in the introduction part, TCC (or TCR) has been involved in many fields such as aircraft, semiconductors and electronic device [19]. As mentioned above, TCC could be estimated by several simplified models, but it is still challenging to estimate the correct value owing to the uncertainty of several parameters.…”
Section: Initial Simulation-influence Of Thermal Contact Conductance ...mentioning
confidence: 99%
“…Referring to the previous argument in the introduction part, TCC (or TCR) has been involved in many fields such as aircraft, semiconductors and electronic device [19]. As mentioned above, TCC could be estimated by several simplified models, but it is still challenging to estimate the correct value owing to the uncertainty of several parameters.…”
Section: Initial Simulation-influence Of Thermal Contact Conductance ...mentioning
confidence: 99%
“…Its initial temperature is T M0 , see again figure 1. Quite obviously, and as discussed elsewhere [20], the hypothesis of ideal thermal contact is only partly satisfied: one should rather consider the actual roughness of the bodies (of both the skin surface and the external material) as well as even more complicated details which, on average, give rise to a contact thermal resistance which is quite difficult to be properly and quantitatively taken into account [21]. In view of our needs of a simple rendition of this problem, we insist with the perfect contact hypothesis throughout the following discussion.…”
Section: A Simple Conductive Model Of Human Skinmentioning
confidence: 99%
“…The target thermal conductivity varies, depending on the industry and intended application, with some aiming at ~10 Wm −1 K −1 while others target more than 25 Wm −1 K −1 [212]. There is also a specific goal of reducing the thermal contact resistance [213], [214]. These industry needs and market trends open a wide application domain for graphene and FLG as fillers in thermal composites.…”
Section: Commercial Applications Of Graphenementioning
confidence: 99%