Research on Measurement Accuracy of the Double‐Channel Microwave Power Sensors Based on an MEMS Cantilever Beam

Wang, Debo; Wu, Lixian; Li, Longfei; Dai, Ruiping

doi:10.1049/cje.2019.06.011

Cited by 3 publications

(3 citation statements)

References 6 publications

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“…Microstructures based on silicon substrates are, therefore, a key issue in bulk micromachining technology. Bulk Si three-dimensional (3D) micromachined structures (e.g., cavities, grooves, through holes, and mesas) have been an area of extensive research in microelectromechanical systems (MEMS) [1][2][3][4]. From the fabrication point of view, etching techniques are divided into two main categories: deep reactive ion etching (DRIE) and anisotropy wet etching.…”

Section: Introductionmentioning

confidence: 99%

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Wang

2020

Micromachines

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To create approximately spherical structures with curved sidewalls, this paper presents a method for building a series of decreasing slopes along the sidewall of a circular truncated cone. The multistep ring-edge etching technology of first reducing the concentric mask and then cutting the top off to create a mesa shape can be used to form the slopes. This wet-etching method avoids the constraints of crystallographic properties with surfactant-added Tetramethylammonium hydroxide (TMAH), enabling the manufacture of successive given inclination angles, the precise modulation of the spherical curvature by reduction design of concentric masks, and the setting of etching time. The newly approximated spherical Si microstructure patterns can be used for microlenses, quartz crystal resonators, micropulleys, and other applications. The present research is an approach to fabricate advanced microelectromechanical systems (MEMS) curved-surface structures, extending the range of 3D structures fabricated by silicon wet etching.

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Section: Introductionmentioning

confidence: 99%

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Wang

2020

Micromachines

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“…Wang et al developed a wearable fallproof electronic pants, which integrates many microelectronic devices. These microelectronic devices are mainly composed of microcontrollers or microprocessors, sensors, communication chips, and other modules, and most of the power supply methods are battery power supply [5]. Gu et al used the circular microphone array for the first time to collect sound, detect falls through sound, and locate the location of falls [6].…”

Section: Literature Reviewmentioning

confidence: 99%

Detection of Human Energy Consumption in Sports Based on MEMS Sensor

Zhou

2022

Mobile Information Systems

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In order to explore the problem of human energy consumption in sports, a method based on MEMS sensor is proposed. Firstly, the data of the whole system is analyzed, including acceleration signal preprocessing, data fusion between accelerometer and gyroscope using the Kalman filter method, and feature extraction. Secondly, each module and the whole system are tested, respectively. Finally, the accuracy experiment is compared with other human motion energy consumption measurement devices to verify the feasibility and superiority of the system. The experimental results show that when measuring human motion energy consumption, the average accuracy of a bracelet 1 is 87%, the average accuracy of a bracelet 2 is 88%, the average accuracy of a bracelet 3 is 96%, and the average accuracy of the system is 94%.The system has relatively high accuracy in measuring human motion energy consumption, and its algorithm is more accurate. It is proved that MEMS sensor can effectively detect human energy consumption in sports.

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“…Micro electro mechanical system (MEMS), also known as microelectronic mechanical system, refers to micro system manufactured using micromachining technology and integrated circuit technology. [1][2][3] MEMS is a frontier field integrating mechanics, electronics, computer software and other disciplines, which has become one of the most rapidly developing science and technology. [4][5][6] In MEMS field, micro-resonance sensor has the most market and development potential.…”

Section: Introductionmentioning

confidence: 99%

Free vibration for a micro resonant pressure sensor with cross-type resonator

Han

2021

Advances in Mechanical Engineering

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In this paper, a cross resonator pressure sensor is proposed to improve the detection accuracy of capacitor-detecting sensor. Considering electrostatic force and molecular force, the multi-field coupled dynamic equation of the sensor is established. By solving the dynamic equation, the equations for the mode function and the natural frequencies of the resonator are obtained. Using these equations, the natural frequency and mode function of the sensor are given. Changes of natural frequency of sensor with main parameters are studied. Influence of molecular force on the natural frequency is analyzed. Results show that within a considerable range of pressure, the natural frequencies increase approximately linearly with pressure. Under small pressure, small initial distance between resonator and base, and lower order modes, effects of the Van der Waals force on the natural frequencies are quite obvious.

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Research on Measurement Accuracy of the Double‐Channel Microwave Power Sensors Based on an MEMS Cantilever Beam

Cited by 3 publications

References 6 publications

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Detection of Human Energy Consumption in Sports Based on MEMS Sensor

Free vibration for a micro resonant pressure sensor with cross-type resonator

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