Research and application of high precision chip mounter for optical module laser

Abstract

With the continuous development of the new generation of semiconductor devices and modules, the size of high-end chips has also been further reduced. With the purpose of adapt to the rapid development of high-end chips, the chip mounting technology and equipment have also entered a rapid iterative development stage. Nowadays, the chip mounter is developing towards the direction of high intelligence, high precision, high efficiency, green and automatic. High precision patch equipment has been the focus of research at home and abroad. This paper summarizes the current situation of the demand for high-precision mounting technology of optical module laser in the 5G/6G field, introduces the main performance index requirements of high-precision mounting machine equipment, and systematically expounds the application status, advantages and disadvantages of high-precision mounting machine from three aspects of visual detection technology, mounting path optimization, and motion control system. The research shows that how to improve the speed and precision of mounting is still the bottleneck of the industry. Therefore, the research on the key technology of high precision and high-speed mounting has become an important competitive focus in the field of chip mounter equipment.