Reprocessable and Shape Memory Thermosetting Epoxy Resins Based on Silyl Ether Equilibration

Abstract

A novel epoxy thermoset is synthesized with dynamic SiOSi bonds. The thermosetting epoxy resins possess excellent reprocessing, reshaping, and shape memory ability due to the special molecular structure. The material exhibits high tensile strength and a fast stress relaxation process. Surprisingly, it can achieve complete healing and keep stable mechanical property after multi‐processing.

Preparation of modified multi‐walled carbon nanotubes as a reinforcement for epoxy shape‐memory polymer composites

“…In the past few decades, shape‐memory polymer (SMP) has become a fast‐developing research field due to its unique shape‐memory characteristic and its great potential in field applications 1‐4 . With the appropriate external stimuli, such as heat, light, magnetism, SMP plays important roles in the fields of medicine, clothing, aerospace, etc 5 .…”

“…With the appropriate external stimuli, such as heat, light, magnetism, SMP plays important roles in the fields of medicine, clothing, aerospace, etc 5 . Epoxy resin especially, because of its good mechanical strength, favorable chemical stability, and low price, has captured the attention of researchers 4,6,7 . The existing literature contains much research on the design and structure of SMPs to enhance their mechanical properties and toughness, and to afford multiple responsiveness 8‐11 .…”

Effects of networks composed of epoxy/dual thiol‐curing agents on properties of shape memory polymers

“…This memory characteristic enables polymers to form a permanent shape and then transformed to another temporary shape under external force. Some certain stimuli (e.g., electric, heat, magnetic field, and heat) will lead to a shape transformation from temporary to permanent, just like “switch” 1,4,5 . Various types of stimuli sensitive SMPs have been developed to meet work requirements and present great application potential in many fields, such as aerospace, medicine, and electronics 6–9 …”

Polyethylene glycol modified epoxy acrylateUVcurable3Dprinting materials

“…In the acrylate-based photo-curable system, the bisphenol-A epoxy acrylate is a common matrix. 6,7 The liquid consumables and their UV cured products are not conducive to application due to the lack of flexibility, though with small volume shrinkage, high photo-reactivity, and excellent strength. Therefore, flexible 3D printed product is an important development trend in the future.…”