Reliability Study on Adhesive Interconnections in Flex-to-Flex Printed Electronics Applications Under Environmental Stresses

Happonen, Tuomas; Voutilainen, Juha-Veikko; Fabritius, Tapio

doi:10.1109/tdmr.2014.2356477

Cited by 19 publications

(10 citation statements)

References 20 publications

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“…For level 2 interconnects, contacts are mostly realized by means of soft solder and conductive adhesives. For these nondetachable types of interconnects, even on printed electronics, a small number of publications can be found [11][12][13][14][15][16][17][18]. More often, epoxy based isotropic conductive adhesives are used to create those level 2 interconnects [11][12][13][14][15][16][17][18].…”

Section: Background and Motivationmentioning

confidence: 99%

“…For these nondetachable types of interconnects, even on printed electronics, a small number of publications can be found [11][12][13][14][15][16][17][18]. More often, epoxy based isotropic conductive adhesives are used to create those level 2 interconnects [11][12][13][14][15][16][17][18]. In [12] it has been shown that the electrial resistances as well as the long-term behaviour of such interconnects on printed conductor patterns are comparable to those on conventionally etched printed circuit boards [12,13].…”

Section: Background and Motivationmentioning

confidence: 99%

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Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer¹,

Hümmer²,

Klauß³

et al. 2021

Flex. Print. Electron.

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Hybrid printed electronics (HPE) combines advantages of conventional electronics manufacturing technologies such as surface mount technology with those of printed electronics in order to realize more complex electronic systems. To realize the final product, such HPE subassemblies have to be connected to higher-level assemblies. So far interconnection techniques for the so-called level 3 interconnection between printed subsystems and standard electronics have not yet been considered adequately in scientific research. In this paper, alternative detachable level 3 interconnection technologies, i.e. spring loaded contact pins, zero insertion force (ZIF) as well as Non-ZIF connectors are investigated systematically regarding their electrical behaviour against the background of printed electronics. Screen-printed silver filled polymer thick film paste is used to realize printed conductor patterns on flexible polymer substrates, which are connected later on with the alternatives mentioned above. Transition resistance is measured using the four wire method as produced, after repeated mating cycles as well as after accelerated aging tests. The various electrical contacts are subjected to thermal stress in temperature cycling testing and during aging at a constant high temperature. As a result it can be stated, that the sping-loaded contact pins used in this investigation show superior behavior compared with the selected connectors in terms of resistance increase after mating cycles. Concerning long-term behavior after thermal cyling and high temperature storage, all investigated alternaives reveal convincing results.

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Section: Background and Motivationmentioning

confidence: 99%

Section: Background and Motivationmentioning

confidence: 99%

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Schirmer¹,

Hümmer²,

Klauß³

et al. 2021

Flex. Print. Electron.

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“…To test the performance of the samples under cyclic mechanical loading, three foil-only samples and three overmolded samples, were subjected to cyclic bending tests at the University of Oulu's test facilities. The custom constructed test apparatus repeatedly rolled the test samples over a cylinder with a 15 mm radius [19]. Due to the design of the personal activity meter, two different attachment positions were used, the first to focus the manipulation on the display element and the second on the electronic part, see Figure 10.…”

Section: Stability Studiesmentioning

confidence: 99%

Adopting Hybrid Integrated Flexible Electronics in Products: Case—Personal Activity Meter

Kololuoma

Keränen²,

Kurkela

et al. 2019

IEEE J. Electron Devices Soc.

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In this case study, the possibilities of hybrid integration of printed and flexible electronics in combination with conventional electronic components to create new types of product concepts is demonstrated. The final result is a personal activity meter demonstrator, which is realized by utilizing various flexible electronics manufacturing and integration techniques. Roll-to-roll printing was used to print the electronic backplane as well as co-planar electrochromic (EC) display. A pick-and-place assembled microcontroller unit and accelerometer, together with passive components, provided the brains for the system. Injection molding was then utilized to create a structural electronics system including an EC display. To validate the feasibility and scalability of the processes used, 100 pieces of the personal activity meter were fabricated. Modeling with continuum computational fluid dynamics and numerical heat transfer, using the high-performance finite volume method, showed that high filling pressure and shear-stress are the key factors causing broken devices. The stability of the devices in harsh environmental conditions as well as in bending seem to be slightly improved in the over molded samples. INDEX TERMS Electrochromic displays, injection molding, hybrid integration, printed electronics, structural electronics. TERHO KOLOLUOMA received the Ph.D. degree in chemistry from the University of Oulu in 2003. From 1998 to 1999, he was with the University of Oulu having a responsibility on fabrication and characterization of solgel-based materials. From 1999 to 2003, he was with VTT Electronics for developing new materials for optoelectronic applications. During that period, he started the first experiments in the area of roll-to-roll printed electronics and optoelectronics and started to lead various research project in that field. After finishing his Ph.D. thesis in 2003, he started as a Senior Scientist focusing on development of printed electronics components and technologies, and since 2010, he has a Principal Scientist. From 2013 to 2015, he was with National Research Council Canada, he is currently a Research Team Leader of printed electronics processing team with VTT. His main research topic is printable optics and electronics. Of his special interests are novel materials for printed electronics and materials-process interface.

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“…The connecting lines were ink-jet printed and screen-printed, while the hybrid interconnections were obtained with means of a commercial ACA, as shown in Figure 13. An extensive study on the stability and reliability of similar solutions has been presented, already in 2014, by Happonen et al [42], who thoroughly investigated the resiliency of conducting adhesives employed for the connection of separate flexible foils. They explored different bonding solutions and performed a live measurement of the DC 4-wires resistance during several thermal and bending cycles.…”

Section: Towards On-chip Integrationmentioning

confidence: 99%

Technological Integration in Printed Electronics

Rivadeneyra¹,

Loghin²,

Falco³

2018

Flexible Electronics

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Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and-potentially-cost effectiveness. This kind of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this trend, the cost and environmental impact are gradually becoming a substantial issue. One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in one process flow and the integration of printed electronics with conventional systems.

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Reliability Study on Adhesive Interconnections in Flex-to-Flex Printed Electronics Applications Under Environmental Stresses

Cited by 19 publications

References 20 publications

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Evaluation of detatchable board-to-board interconnects on screen printed electronic structures

Adopting Hybrid Integrated Flexible Electronics in Products: Case—Personal Activity Meter

Technological Integration in Printed Electronics

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