1999 GaAs Reliability Workshop. Proceedings (Cat. No.00TH8459)
DOI: 10.1109/gaasrw.1999.874171
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Reliability performance of components and ICs from a production 1 μm GaAs HBT process

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Cited by 7 publications
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“…Very low collector-substrate capacitance C cs in AlGaAs/GaAs HBTs due to the use of semi-insulating GaAs substrate (resistivity ≈10 7 Ohm-cm). (4) High efficiency due to the ability to turn off devices completely with a small base voltage change and the extremely small turn-on voltage variation between devices. (5) Good wide-band impedance matching due to the resistive nature of the input and output impedances.…”
Section: Yc Chou and R Ferromentioning
confidence: 99%
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“…Very low collector-substrate capacitance C cs in AlGaAs/GaAs HBTs due to the use of semi-insulating GaAs substrate (resistivity ≈10 7 Ohm-cm). (4) High efficiency due to the ability to turn off devices completely with a small base voltage change and the extremely small turn-on voltage variation between devices. (5) Good wide-band impedance matching due to the resistive nature of the input and output impedances.…”
Section: Yc Chou and R Ferromentioning
confidence: 99%
“…The parameters in Equations (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19) and (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20) are q, the electronic charge; k, Boltzmann constant; T, temperature; A, the emitter-base junction area; D n , the electron diffusivity in the base; W, the base width; N E , the emitter doping concentration; D p , the hole diffusivity in the emitter; and L p , the hole diffusion length in the emitter. Obviously,…”
Section: B Operating Principlesmentioning
confidence: 99%
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