Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions

BGA Interconnection Reliability in Mirrored Module Configurations

“…With generally used array type interconnections, the failure location can differ depending on the materials used. It is often reported that interconnections situated under the die corner area are the most prone to failure in both TCTs and FEM simulations, but also the corner interconnection of the whole package could be the most critical one [27], [35]- [37]. It can be observed in Figure 4 that in the places where rupturing of the PCB occurs, the solder ball is not cracked as much.…”

Iterative Machine Learning-Aided Framework Bridges Between Fatigue and Creep Damages in Solder Interconnections

“…With Weibull-distributed data and several nonlinear models employed, solder chemical composition, thermal related specifications [26], and solder joint geometry [27] are found as the key parameters in stimulating the failure mechanism of the solder joint. Ma et al [28] declared that the failure rate in the solder joints depends heavily on the size of the package and the metallurgical aspect of the solder material. Hazard regression analysis was proposed by Raj et al [5] to appropriately estimate the useful lifetime of the solder joint, where the aging conditions of the solder joint as well as its composition were found as the primary factors in the solder joint degradation.…”

Structural health monitoring of solder joints in QFN package

“…However the drawback of QFN package is its low reliability for thermal cycles' environment like automotive and aerospace industry. QFN lifetime will be roughly 3 times shorter than a BGA package [1][2][3]. Prognosis of package end-of-life will not change its reliability but in some applications it could avoid abrupt failure by scheduled maintenance or replacement of the module.…”