Structural health monitoring of solder joints in QFN package

Gershman, Israel; Bernstein, J.B.

doi:10.1016/j.microrel.2012.07.001

Cited by 16 publications

(4 citation statements)

References 10 publications

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“…An accurate fit was received between the analytical model and the FEA model. The results of the two previous studies are formulated into a health-monitoring technique in [ 89 ].…”

Section: Reliability Analysis and Life Prediction Of Packaging Materi...mentioning

confidence: 99%

Modern Trends in Microelectronics Packaging Reliability Testing

Bender,

Bernstein,

Boning

2024

Micromachines

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In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

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“…An accurate fit was received between the analytical model and the FEA model. The results of the two previous studies are formulated into a health-monitoring technique in [ 89 ].…”

Section: Reliability Analysis and Life Prediction Of Packaging Materi...mentioning

confidence: 99%

Modern Trends in Microelectronics Packaging Reliability Testing

Bender,

Bernstein,

Boning

2024

Micromachines

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“…Many researchers conducted studies to develop system health monitoring methods using electrical parameters in the time or frequency domain. Gershman et al [ 1 ] suggested a quantitative measurement tool based on the serial ohmic resistance changes at solder joints; the serial ohmic resistance in such cases was used to monitor crack propagation in the solder joints of a quad flat non-leads (QFN) package. Their experimental results showed that the serial ohmic resistance increased as a result of the crack growth.…”

Section: Introductionmentioning

confidence: 99%

Development of a Non-Invasive On-Chip Interconnect Health Sensing Method Based on Bit Error Rates

Shin¹,

Koo²,

Kwon³

2018

Sensors

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Electronic products and systems are widely used in industrial network systems, control devices, and data acquisition devices across many industry sectors. Failures of such electronic systems might lead to unexpected downtime, loss of productivity, additional work for repairs, and delay in product and service development. Thus, developing an appropriate sensing technique is necessary, because it is the first step in system fault diagnosis and prognosis. Many sensing techniques often require external and additional sensing devices, which might disturb system operation and consequently increase operating costs. In this study, we present an on-chip health sensing method for non-destructive and non-invasive interconnect degradation detection. Bit error rate (BER), which represents data integrity during digital signal transmission, was selected to sense interconnect health without connecting external sensing devices. To verify the health sensing performance, corrosion tests were conducted with in situ monitoring of the BER and direct current (DC) resistance. The eye size, extracted from the BER measurement, showed the highest separation between the intact and failed interconnect, as well as a gradual transition, compared with abrupt changes in the DC resistance, during interconnect degradation. These experimental results demonstrate the potential of the proposed sensing method for on-chip interconnect health monitoring applications without disturbing system operation.

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“…The well-known quad flat non-lead (QFN) devices are examined in the present work and detailed in various documents [9][10]. Different aspects of these devices were also examined to improve their integration in the industrial assemblies [11][12][13][14]. The assemblies containing these devices requires precise knowledge of the convective heat transfer coefficient on all of the assembly's surfaces.…”

Section: Introductionmentioning

confidence: 99%

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

Baı̈ri

Roseiro

Martín-Garín

et al. 2017

Microelectronics Reliability

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The performance and reliability of electronic components and assemblies strongly depend on their thermal state. The knowledge of the temperature distribution throughout the assembly is therefore an essential element to ensure their correct operation. This is the main objective of this work that examines the case of a conventional assembly equipped with a quad flat non-lead QFN64 subjected to free convection. This active electronic package is welded on a PCB which may be inclined by an angle varying between 0°and 90°(horizontal and vertical positions respectively) and generates during its operation a high power ranging from 0.1 to 1 W. Thermoregulation of the assembly is ensured by natural convection, given its many well known advantages in this engineering field. Accurate relationships are proposed to determine the temperature on different areas of the device and the PCB. They are determined by means of a 3D numerical approach based on the finite volume method confirmed by measurements on an actual installation. These relationships allow reliability improvement of these electronic assemblies that are widely used in many engineering fields such as computing industry, mobile telephony, home automation, automotive, embarked electronics and the smart building applications considered in this work. The present survey complements a recent study which quantifies the natural convective heat transfer on the considered electronic assembly equipped with the QFN64 device, for the same power range and angle of inclination.

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Structural health monitoring of solder joints in QFN package

Cited by 16 publications

References 10 publications

Modern Trends in Microelectronics Packaging Reliability Testing

Modern Trends in Microelectronics Packaging Reliability Testing

Development of a Non-Invasive On-Chip Interconnect Health Sensing Method Based on Bit Error Rates

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

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