Reliability of lead-free solder joints in CSP device under thermal cycling

Zhang, Liang; Sun, Lei; Guo, Yong-huan; He, Chengwen

doi:10.1007/s10854-014-1711-y

Cited by 49 publications

(11 citation statements)

References 8 publications

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“…5 plots the history of von Mises stress at the most critical locations of all studied WLCSP assembly based on Anand model for SnAgCu and SnAgCuZn solder joints for ten cycles, respectively. It is found that the tendency of curves based on Anand equations is similar to that of curves based on Garofalo-Arrhenius [36]: stress relax appears at the initial stage of temperature loading, periodic variety can also be found in the figure. In addition, it is observed that the first cycle behavior is different from others, which indicates that the initial stress-strain response of solder joints is not stable.…”

Section: Finite Element Simulationssupporting

confidence: 55%

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

Zhang

Cui

Han

et al. 2014

International Journal of Nonlinear Sciences and Numerical Simulation

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With the addition of Zn, Co and Fe, the microstructures and properties of SnAgCu solders can be improved obviously, the constitutive response of SnAgCu solder bearing 0.8%Zn, 0.8%Co and 0.8%Fe was studied under uniaxial tension. Anand model was used to represent the inelastic deformation behavior of the lead-free solders. The material parameters of the constitutive relations for SnAgCu(Zn,Co, Fe) solders were determined from separated constitutive relations and experimental results. Combining the model, finite element analysis (FEA) was used to study the thermally induced in elastic deformation and the stress-strain response of the solder joints in wafer-level chip scale packages (WLCSP) mounted on printed circuit boards (PCB). And it is found that the addition of Zn, Co and Fe can enhance the fatigue life of SnAgCu solder joint, the superiority can be found for the addition of Fe among the three elements.

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Section: Finite Element Simulationssupporting

confidence: 55%

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

Zhang

Cui

Han

et al. 2014

International Journal of Nonlinear Sciences and Numerical Simulation

Self Cite

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“…Interest in alloys based on Sn-Zn eutectic as a lead-free solder is enormous. Almost all of the existing scientific articles are related to corrosion studies [18][19][20][21], to thermodynamic description [22][23][24][25], the influence of alloying additives on melting points, wetting, mechanical and electrical properties [26][27][28] and on properties solder joints [29][30][31][32]. However, there is no report in the literature that describe the effect of physicochemical properties of these alloys on the wettability and on the phenomena occurring in the solder joint.…”

Section: (3) B (2017) 309 -318mentioning

confidence: 99%

The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system

Pstruś

2017

J min metall B Metall

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The measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were carried out using the sessile drop method, dilatometric technique and capillary method. The measurements were performed at temperature range between 493 and 843 K. The technique of sessile drop was applied in the measurements of wetting angles and spreading test in the SnZnIn/ Cu system. Surface tension, density and viscosity measurements were carried out in a protective argon-hydrogen atmosphere. Wettability tests were performed in air in the presence of flux Alu33, at 250°C for 2 minutes. Subsequently, the microstructure of solder and the resulting joints was studied. The addition of In to eutectic Sn-Zn alloy improved the wetting properties and causes a reduction of thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate.

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“…According to MIL-STD-883 specification [16] , thermal cycle loading was selected to be imposed on the WLCSP30 assembly. It was performed at temperatures ranging from 218 K to 398 K, with dwell time at all peak temperature 15 min, the rates of descend and ascend temperature 15 K/min.…”

Section: Finite Element Simulationmentioning

confidence: 99%

Reliability of SnAgCuFe Solder Joints in WLCSP30 Device

Zhang

Guo

Sun

et al. 2016

Rare Metal Materials and Engineering

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Anand constitutive model of SnAgCuFe solder joints was studied, and 9 parameters were determined based on tensile testing. And the model was incorporated in finite element code for analyzing the stress-strain response of SnAgCuFe solder joints in WLCSP30 device. The results indicate that the maximum stress concentrates on the top surface of corner solder joints, and the stress-strain of SnAgCuFe solder joints is lower than that of SnAgCu solder joints. Based on the fatigue life model, the addition of Fe can enhance the fatigue life of SnAgCu solder joints. Therefore, the SnAgCuFe solders can replace the traditional SnPb to be used in electronic packaging.

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Reliability of lead-free solder joints in CSP device under thermal cycling

Cited by 49 publications

References 8 publications

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system

Reliability of SnAgCuFe Solder Joints in WLCSP30 Device

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