Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging

Abstract

With the addition of Zn, Co and Fe, the microstructures and properties of SnAgCu solders can be improved obviously, the constitutive response of SnAgCu solder bearing 0.8%Zn, 0.8%Co and 0.8%Fe was studied under uniaxial tension. Anand model was used to represent the inelastic deformation behavior of the lead-free solders. The material parameters of the constitutive relations for SnAgCu(Zn,Co, Fe) solders were determined from separated constitutive relations and experimental results. Combining the model, finite element analysis (FEA) was used to study the thermally induced in elastic deformation and the stress-strain response of the solder joints in wafer-level chip scale packages (WLCSP) mounted on printed circuit boards (PCB). And it is found that the addition of Zn, Co and Fe can enhance the fatigue life of SnAgCu solder joint, the superiority can be found for the addition of Fe among the three elements.

Influence of TiO2 and Al2O3 Nanoparticles Addition on Thermal, Wettability and IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow Temperature

“…The use of harmful substances in electronic products have been prohibited by the European Union's Restriction of Hazardous Substances (RoHS) in 2006 [1,7]. As a result of the lead restriction in the electronic industry, there has been an increasing number of lead-free solders been investigated and developed to replace them [8,9]. Sn-Ag-Cu lead-free solder is one of the most promising lead-free solders due to its superior reliability, creep resistance and thermal fatigue properties [10].…”

Wettability optimization analysis of lead-free solders with Taguchi method

“…These years, the investigation of lead-free solders has become an important research aspect in electronic industry, SnAgCu, SnAg, SnZn, SnCu etc. have been studied to replace the SnPb solder, moreover, the SnAgCu solder have be proposed as the most promising alternative [4], because of its good soldering and wetting behavior on several substrate materials such as Cu, Ag, Au, Ni and respective alloys [5]. However, the poor wettability of SnAgCu solders can be found comparing with traditional SnPb solder used in electronic device [6].…”