Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Xiong, Ming-yue; Zhang, Liang

doi:10.1007/s10853-018-2907-y

Cited by 170 publications

(64 citation statements)

References 100 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In recent years, the research on Sn-Ag-Cu (SAC) solder alloys with high silver content has increased exponentially, because they usually have good mechanical behavior and good welding ability, making them a promising material for microelectronic applications [ 10 , 11 , 12 , 13 , 14 ]. However, SAC solder alloy also has the defects of low melting point and short creep rupture life, which cannot replace high-temperature tin-lead solder [ 15 ]. Studies on high-temperature lead-free solder with melting point above 300 °C are imminent.…”

Section: Introductionmentioning

confidence: 99%

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Yan

Gao

et al. 2020

Materials

View full text Add to dashboard Cite

To obtain Sn-3.0Ag-0.5Cu-xSb (x = 0, 25, 28, and 31) high-temperature lead-free solder antimony was added to Sn-3.0Ag-0.5Cu solder. The microstructure, thermal properties, and mechanical behavior of the solder alloy prepared were studied by using JSM-5610LV scanning electron microscope, Germany STA409PC differential scanning calorimeter, AG-I250KN universal tensile testing machine, and other methods. The SEM-EDS results showed that after adding Sb, SnSb phase was formed in the β-Sn matrix phase. The newly formed SnSb phase and the existing Sb in the solder alloy can inhibit the generation of IMC and refine the IMC layer. The addition of Sb significantly increased the melting temperature of the solder alloy. Among them, the thermal performance of Sn-3.0Ag-0.5Cu-25Sb is the best. The melting temperature of Sn-3.0Ag-0.5Cu-25Sb is 332.91 °C and the solid–liquid line range of Sn-3.0Ag-0.5Cu-25Sb solder alloy is 313.28–342.02 °C. Its pasty range is 28.74 °C, lower than 30 °C, which is beneficial for soldering. The test results of the mechanical behavior of Sn-3.0Ag-0.5Cu-xSb solder alloy show that with the increase of Sb addition, the ultimate tensile strength of the solder alloy also increases. However, the change of the elongation of the solder alloy is the opposite. The ultimate tensile strength of the solder alloy increased from 29.45 MPa of Sn-3.0Ag-0.5Cu solder to 70.81 MPa of Sn-3.0Ag-0.5Cu-31Sb solder. The reason for the increase in the strength of the solder alloy is the reduction of the thickness of IMC and the solid solution hardening effect of Sb.

show abstract

Section: Introductionmentioning

confidence: 99%

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Yan

Gao

et al. 2020

Materials

View full text Add to dashboard Cite

show abstract

“…In modern aircraft electronic devices, soldering is a very common method for achieving the connection between substrate and chip, which can provide good reliability and mechanical connection. 1,2 Therefore, it is vital to improve the reliability of the solder joint in electronic devices such as cell phones, laptops and smart devices. [3][4][5] The Cu-2.0Be alloy is widely used as a substrate in aircraft electronic devices, and is the best candidate to replace the pure Cu substrate due to its good corrosion resistance, mechanical properties and wettability.…”

Section: Introductionmentioning

confidence: 99%

Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate

Yin

Mei

et al. 2020

Journal of Elec Materi

View full text Add to dashboard Cite

The effect of Ni nanoparticles on the microstructure evolution of a Sn-3.0Ag-0.5Cu (SAC305)-xNi (x = 0, 0.1)/Cu-2.0Be solder joint during reflow and aging was investigated. The results showed that the doped Ni nanoparticles changed the intermetallic compound (IMC) morphology from a scallop-like structure into a planar-like structure. The interfacial IMC layer thickness of the SAC305/Cu-2.0Be solder joint was greater than that of the SAC305-0.1Ni/Cu-2.0Be solder joint after reflow and aging. During reflow, the average IMC growth rate of the SAC305/Cu-2.0Be solder joint was 1.62 9 10 À2 lm/s, while the average IMC growth rate of the SAC305-0.1Ni/Cu-2.0Be solder joint was 1.56 9 10 À2 lm/s. During aging, the growth rates of the interfacial IMC layer of the SAC305/Cu-2.0Be solder joint and SAC305-0.1Ni/Cu-2.0Be solder joint were 1.86 9 10 À5 lm/s and 1.46 9 10 À5 lm/s, respectively. The results show that a trace amount of Ni nanoparticles can impede the growth rate of the interfacial IMC layer.

show abstract

“…A severe CTE mismatch always results in strong interfacial shear and peeling stresses near the interfacial edges and corners. When the local stress level exceeds the bonding strength of the interface, an interfacial crack will initiate and propagate [5][6][7]. Therefore, it is of practical importance to model these stresses using analytical tools, so that the susceptibility to thermal mechanical failure can be predicted for chips with new geometries and material combinations, without costly trial and error.…”

Section: Introductionmentioning

confidence: 99%

GA-BP in Thermal Fatigue Failure Prediction of Microelectronic Chips

Han

Huang

2019

Electronics

View full text Add to dashboard Cite

A thermal fatigue life prediction model of microelectronic chips based on thermal fatigue tests and solder/substrate interfacial singularity analysis from finite element method (FEM) analysis is established in this paper. To save the calculation of interfacial singular parameters of new chips for life prediction, and improve the accuracy of prediction results in actual applications, a hybrid genetic algorithm–artificial neural network (GA–ANN) strategy is utilized. The proposed algorithm combines the local searching ability of the gradient-based back propagation (BP) strategy with the global searching ability of a genetic algorithm. A series of combinations of the dimensions and thermal mechanical properties of the solder and the corresponding singularity parameters at the failure interface are used to train the proposed GA-BP network. The results of the network, together with the established life prediction model, are used to predict the thermal fatigue lives of new chips. The comparison between the network results and thermal fatigue lives recorded in experiments shows that the GA-BP strategy is a successful prediction technique.

show abstract

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Cited by 170 publications

References 100 publications

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Effects of Ni Nanoparticles on the Growth Rate of Intermetallic Compounds (IMCs) Between Sn-3.0Ag-0.5Cu (SAC305) Solder and Cu-2.0Be Substrate

GA-BP in Thermal Fatigue Failure Prediction of Microelectronic Chips

Contact Info

Product

Resources

About