2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00221
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Reliability of Laminated Bond Structure Using (Cu, Ni)/Sn TLP Bonding with Al Interlayer for High Temperature Power Electronics Packaging

Yanghe Liu1,
Saurabh Joshi2,
Ercan M. Dede3
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