Reliability of High-Power IGBT Modules for Traction Applications

Ciappa, Mauro; Castellazzi, Alberto

doi:10.1109/relphy.2007.369938

Cited by 35 publications

(31 citation statements)

References 5 publications

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“…The thermal impedance is derived from the cooling curve by equation (2). The structure function which is then derived from the thermal impedance is a graphical representation of the device structure that makes use of the thermal models (Foster and Cauer).…”

Section: Structure Functionmentioning

confidence: 99%

“…After filtering the thermal transient curve, the next step is calculating the thermal impedance curve from the thermal transient using equation (2). The cooling curve can be described by in the simplest form by the response function of a single time constant system.…”

Section: Structure Functionmentioning

confidence: 99%

“…The first op-amp (highlighted in red) does the mathematical function of producing 2Vb in (18). The second part (highlighted in green) of the circuit completes the mathematic function using a differential amplifier to obtain Vce (2 After the heating period, the cooling curve needs to be measured by passing the low current used to calibrate the device. This is carried out as mentioned earlier by switching on S1 and the others off as shown in Fig.…”

Section: Fig 17 Measurement Processmentioning

confidence: 99%

“…An example of this is power converters used in airborne applications to drive electrical actuators in the close vicinity of the jet engine. In this case, the power devices are required to survive at the same time static environment temperatures of about 200°C during the flight and extreme thermal cycles between -55°C and 200°C with a rate of 10°C/min during landing and take-off [2]. Automotive, rail and wind converters also experience large temperature variations.…”

Section: Introductionmentioning

confidence: 99%

“…A major reason for failures in IGBT modules is mismatched coefficients of expansion (CTE) of the layers an IGBT consists of. The main failure mechanisms are wire-bond cracking, wire-bond lift off , solder joint fatigue ,solder voids, aluminzation [2]. Fig.…”

Section: Introductionmentioning

confidence: 99%

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Prognostic System for Power Modules in Converter Systems Using Structure Function

Aliyu

Castellazzi

2018

IEEE Trans. Power Electron.

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This paper proposes an on-board methodology for monitoring the health of power converter modules in drive systems, using vector control heating and structure function to check for degradation. It puts forward a system that is used on-board to measure the cooling curve and derive the structure function during idle times for maintenance purposes. The structure function is good tool for tracking the magnitude and location of degradation in power modules. The ability to keep regular track of the actual degradation level of the modules enables the adoption of preventive maintenance, reducing or even eliminating altogether the appearance of failures during operation, significantly improving the availability of the power devices. The novelty in this work is the complete system that is used to achieve degradation monitoring; combining the heating technique and the measurement without additional power components except the measurement circuit which can be integrated into the gate drive board and the challenges encountered. Experimental results obtained from this show that it is possible to implement an on-board health monitoring system in converters which measures the degradation on power modules.

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Section: Structure Functionmentioning

confidence: 99%

Section: Structure Functionmentioning

confidence: 99%

Section: Fig 17 Measurement Processmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Prognostic System for Power Modules in Converter Systems Using Structure Function

Aliyu

Castellazzi

2018

IEEE Trans. Power Electron.

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Lifetime Prediction Model of IGBT Modules in EMU

Zhu

Wang

Zhang

et al. 2020

Lecture Notes in Electrical Engineering

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Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment

Martín¹,

Micol²,

Pérès³

2016

Struct Multidisc Optim

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To cite this version:Carmen Martin, Alexandre Micol, François Pérès. Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment. Structural and Multidisciplinary Optimization, Springer Verlag (Germany), 2016, 54 ( 6) Abstract In this paper a method is proposed, introducing an adaptive response surface allowing, on the one hand, to minimize the number of calls to finite element codes for the assessment of the parameters of the response surface and, on the other hand, to refine the solution around the design point by iterating through the procedure. This method is implemented in a parallel environment to optimize the calculation time with respect of the architecture of a computational cluster.

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Reliability of High-Power IGBT Modules for Traction Applications

Cited by 35 publications

References 5 publications

Prognostic System for Power Modules in Converter Systems Using Structure Function

Prognostic System for Power Modules in Converter Systems Using Structure Function

Lifetime Prediction Model of IGBT Modules in EMU

Adaptive response surface method supporting finite element calculations: an application to power electronic module reliability assessment

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