Abstract:In this paper, the authors will discuss the die cracking/thin film delamination failures seen in 8-layer 0.13 um silicon during the development of an EBGA package with 45 mm x 45 mm body size. The die size was 15.2 mm per side with over 1400 wire bonded pads. The large package body size and die size provided both manufacturing and reliability challenges.It was pointed out that, due to the large die size and complex 8-layer metal silicon process used, the reliability performance heavily relies on the optimizati… Show more
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