Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test

Yaguchi, Akihiro; Yamada, Mitsuhiro

doi:10.5104/jiep.6.314

Cited by 12 publications

(5 citation statements)

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“…Simpler test methods that focus on inducing PCB bending at high frequency were proposed. Yaguchi et al [29] and Nakado et al [30] of Hitachi reported an impact bending test method in which the PCB assembly, clamped at two ends, is impacted at its center by a falling plunger (Fig. 7a).…”

Section: Ic Componentmentioning

confidence: 99%

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A review of board level solder joints for mobile applications

Wong

Seah

Shim

2008

Microelectronics Reliability

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Section: Ic Componentmentioning

confidence: 99%

“…(a) Impact bending test setup by Hitachi[29,30], (b) Motorola[31], and (c) CALCE[32,33]. Near half-sine response of PCB subjected to impact bending[30] (Courtesy of JSME Int.…”

mentioning

confidence: 99%

A review of board level solder joints for mobile applications

Wong

Seah

Shim

2008

Microelectronics Reliability

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“…extensive thermal aging [12]. In recent years, a significant number of studies have Board-level tests, on the other hand, allow realistic loading addressed the issue of drop impact failure of solder joints, conditions to be applied to the solder joint, but require more [14][15], who used a tester which properties. applied direct impacts to the PCB using a falling mass.…”

Section: Introductionmentioning

confidence: 99%

“…In recent years, a significant number of studies have Board-level tests, on the other hand, allow realistic loading addressed the issue of drop impact failure of solder joints, conditions to be applied to the solder joint, but require more Two broad areas covered by these studies are 1) test methods testing time and expense due to the requirement of board for assessing the drop impact robustness of solder joints [6-assembly samples. The most widely-used board-level test 11], and 2) the development of life prediction/modeling method is the JEDEC JESD-Bl111 drop test standard [13], methodologies for drop impact [12][13][14]. Given the many which is the basis for a large number of drop impact studies.…”

mentioning

confidence: 99%

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A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

Seah

Wong

Selvanayagam³

et al. 2008

2008 10th Electronics Packaging Technology Conference

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devices, it is also very useful to be able to estimate the life of Due to rapid and continual changes in the components and solder joints under actual usage conditions designs of portable electronic devices, it is essential to have Test methods for assessing the drop impact reliability of the ability to perform quick, cost-effective and accurate solder joints are commonly performed at either the component assessments of the drop impact performance of component level or the board level. In component-level tests -typically interconnections for portable applications. In order to ball shear -loads are applied directly to the solder bumps understand the phenomena of solder joint fatigue under mounted on a package substrate. In board-level tests, loads are impact-induced PCB bending, a tester was developed applied directly to a PCB assembly, which indirectly induces specifically for applying high bending strains at high strain stresses in the solder joints between the component and the rates to a PCB assembly. Fatigue characteristics of solder PCB. joints were determined for various PCB strains, allowing the Much effort has been dedicated to developing a construction of fatigue E-N (strain vs. cycles-to-failure) component-level test method which can assess drop impact curves. Fatigue data was also generated for several bending performance. The earliest reported work on component-level frequencies in a study of the effect of strain rate on drop testing was by Shoji et. al.[6] who used a miniature pendulum impact performance. Higher bending frequencies were found tester to determine the fracture energy of solder joints under to reduce fatigue life. A comprehensive test method would high-speed shear. Since then, more sophisticated tools for also have to be capable of applying variable loading levels in high-speed ball shear have been developed, including order to replicate the complex loading spectrums seen in pendulum testing [8], drop shear [9], and motorized or springactual product drops. A variable amplitude study is presented, driven shear with force/displacement measurement [10-1 1].where crack propagation tracking shows the effect of changes High-speed ball pull studies have also been performed, to a in load levels on the crack growth rate. Finally, a study on the lesser degree [10]. The majority of component-level studies effect of low temperatures on drop impact reliability is have focused on a qualitative approach of correlating shear presented, where fatigue characteristics were obtained using failure modes (e.g. brittle or ductile fracture) with board-level the bend tester fitted with a cold temperature chamber.drop impact performance. However, quantitative measurements of shear fracture strength and fracture energy Introduction were reported to be insensitive to drop impact performance As portable electronic devices (e.g. mobile phones, MP3 [12]. Difficulties in quantitative correlations are due to 1) players) are susceptible to accidental drops in everydaybuse, an significant differences in the solder joint ...

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Reliability Study of Solder Joints in Electronic Packaging Technology

Sharif

Majumder

2019

Harsh Environment Electronics

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Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test

Cited by 12 publications

References 0 publications

A review of board level solder joints for mobile applications

A review of board level solder joints for mobile applications

A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests

Reliability Study of Solder Joints in Electronic Packaging Technology

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