Reliability evaluation of adhesive bonded SMT components in industrial applications

Electrical Resistance and Microstructural Changes of Silver–Epoxy Isotropic Conductive Adhesive Joints Under High Humidity and Heat

“…The appearance of these defects might be caused by thermally induced stresses and strains at the joint interface during the TC test. 1,14,16 Many micrometer-sized cracks appeared at the Sn/epoxy resin interface owing to the CTE mismatch among the joint materials. The accumulation of cracks at the Sn/epoxy resin/Ag filler and at the Ag filler/epoxy resin/Ag filler interfaces seems to be one of the kinds of interfacial degradation in the TC test.…”

“…Failure of the electrical interconnection during thermal cycling (TC) could be caused by coefficient of thermal expansion (CTE) mismatch among the interconnection materials, accumulated thermal stress in the adhesive joints, and interfacial delamination because of adhesion degradation. 1,10,[12][13][14][15][16] However, the electrical resistance of Ag-epoxy ICA joints gradually increases before interfacial delamination. 14 Thus, a definitive explanation and proof of the mechanism of joint degradation are still required.…”

Recent advances in isotropic conductive adhesives for electronics packaging applications

“…But still the replacement of solder by this technology has not been widely adopted by the electronics industry owing to several drawbacks which are mainly seen in the reliability aspect of the adhesive joining, such as limited impact resistance [24,25] and the long-term mechanical and electrical stability concerns [26,92]. Adhesive type [92,93], filler size and shape [62,70], degree of curing [94], and damping properties [56] of the ICAs are among the factors that play important roles in determining the reliability performance of ICAs. Kudtarkar and Morris [95] presented data on ICA reliability and compared various ICAs on the basis of tests performed.…”

Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

“…[1][2][3][4][5][6][7][8][9] Additionally, the replacement of expensive silver fillers by other metal fillers or new materials has been examined for wider applications of ECAs. [10][11][12][13][14] For example, S. K. Kang 10) investigated a low temperature conductive adhesive that was developed with bismuth-tin (Bi-Sn) coated copper powders dispersed in a polymer matrix.…”