Polymer binders for sulfur cathodes play a very critical role as they prerequisites for an in-situ immobilization against polysulfide shuttle and volume change, while ensuring good adhesion within active materials for ion conduction along with robust mechanical and chemical stability. Here, we demonstrate anionic surface charge facilitated bio-polymer binder for sulfur cathodes enabling excellent performance and fire safety improvement. The aqueous-processable tragacanth gum-based binder is adjusted to house high sulfur loading over 12 mg cm−2 without compromising the sulfur utility and reversibility, imparting high accessibility for Li-ions to sulfur particles about 80%. The intrinsic rod and sphere-like saccharidic conformal fraction’s multifunctional polar units act as active channels to reach the sulfur particles. As a result, the binder entraps polysulfides with 46% improvement and restrains the volume changes within 16 % even at 4 C. Moreover, the flexible Li-S battery delivers a stack gravimetric energy density of 243 Wh kg–1, demonstrating high reactivity of sulfur along with good shape conformality, which would open an avenue for the potential development of the compact and flexible high-power device.

Melting range, microstructure, mechanical properties and spreadabililty of Zn-(4$6 mass%)Al-(1$6 mass%)Cu alloys were investigated. Liquidus temperature was targeted between 655 and 675 K, and solidus temperature was targeted to 645 K. The liquidus temperature of the Zn-Al-Cu solders increased with Cu contents, but it decreased with Al contents. Microstructures of the Zn-Al-Cu solders consisted of primary "-phase (CuZn 4 ), -phase (Zn matrix), -eutectic phase (Zn-Al eutectic) and "-eutectic phase (Zn-Cu eutectic), irrespective of the Al and Cu contents. Increasing the Al and Cu contents, hardness and tensile strength increased, but elongation decreased. The Al content played an important role in improving the spread ratio, the Cu content had no significant influence on the spread ratio.

Interfacial reaction and die attach properties of Zn-xSn (x = 20 wt.%, 30 wt.%, and 40 wt.%) solders on an aluminum nitride-direct bonded copper substrate were investigated. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, CuZn 5 , and Cu 5 Zn 8 IMC layers were formed, the thicknesses of which can be controlled by joining conditions such as peak temperature and holding time. During multiple reflow treatments at 260°C, the die attach structure was quite stable. The shear strength of the Cu/solder/Cu joint with Zn-Sn solder was about 30 MPa to 34 MPa, which was higher than that of Pb-5Sn solder (26 MPa). The thermal conductivity of Zn-Sn alloys of 100 W/m K to 106 W/m K was sufficiently high and superior to those of Au-20Sn (59 W/m K) and Pb-5Sn (35 W/m K).

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