2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference 2010
DOI: 10.1109/impact.2010.5699577
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Reliability and failure analysis of capacitive substrate

Abstract: In this study, the high dielectric constant of the polymer/ceramic composites is used to fabricate capacitive substrates. The reliability and failure analysis of the capacitive substrate under temperature and voltage stress have been studied. The mean time to failure (MTTF) of the capacitive substrate shows a voltage exponent value dependence on applied voltage with a constant of ~3.3 as the measurement temperature at 175 o C. The lifetime also indicates a temperature dependence of the MTTF with an activation … Show more

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