Reliability Analysis of SnPb and SnAgCu Solder Joints in FC-BGA Packages with Thermal Enabling Preload

Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

“…16 that the highest pressure in the substrate occurred underneath silicon die corners. Similar non-uniform compressive load was also observed previously in [4][5][6]. The pressure concentration underneath die corners may be attributed to the ''inhomogeneous" flip-chip package configuration.…”

“…Under typical service conditions heatsinking induced pressure at the BGA solder joint level is highly non-uniform [4][5][6]. As a result, excessive solder joint creep collapses would occur in the high pressure locations.…”

“…Chiu et al [5] studied the influence of compressive load on board level reliability for SnPbAg solder joints and developed a prediction model for the compressive creep induced reliability failure. Bhatti et al [6] observed that the presence of compressive preload led to the change of critical solder joint failure locations for both SnPb and SnAgCu flip-chip BGA packages under board level temperature cycling conditions. Beh et al [7] found that the BGA solder joint reliability was strongly affected by the heatsink type and PCB thickness.…”

“…One of the reliability concerns for solder joints in telecommunication and other high performance computing applications is the heatsink assembly induced BGA solder joint bridging failure [4][5][6]. Heatsinks have been used extensively as heat dissipation solutions for microelectronic packages.…”

Reliability Assessment of Preloaded Solder Joint Under Thermal Cycling

“…According to the simulation results, increasing the heat sink load will create more damage in the solder bumps, however, lowers the damage of solder balls. Bhatti et al [13] evaluated the reliability of solder joints in the presence of a preload. 3D nonlinear finite element analysis is performed to simulate the effect of compressive load in thermal cycling.…”