Reliability analysis for fine pitch BGA package

Wu, S.X.; Chin, J.M.; Grigorich, T.; Wu, Xiaohua; Mui, G.; Yeh, Chao-Pin

doi:10.1109/ectc.1998.678789

Cited by 11 publications

(3 citation statements)

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“…Over the last two decades, many models have been developed to estimate the low-cycle fatigue life of SnPb eutectic solder joints [17][18][19][20][21][22][23][24][25][26][27]. Among these models, the crack initiation and growth model proposed by Darveaux in 1995 [28], and revised in 2000 [29], is one of the widely accepted models.…”

Section: Fatigue Life Prediction Of Solder Jointmentioning

confidence: 99%

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Lin

Chen

Liu

et al. 2005

Microelectronics Reliability

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Section: Fatigue Life Prediction Of Solder Jointmentioning

confidence: 99%

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Lin

Chen

Liu

et al. 2005

Microelectronics Reliability

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“…The majority of these models use damage accumulation and predict fatigue failure based on a hysteresis-energy term or a volume-weighted average stress-strain history [19][20][21][22][23]. Syed [24] derived, for purely secondary creep, an expression for the accumulated creep damage that related the crack-growth rate to the rate of creep energy density dissipated using the C* parameter based on the NSW model [25].…”

Section: Nomenclaturementioning

confidence: 99%

A strain energy density method for the prediction of creep–fatigue damage in high temperature components

Payten

Dean²,

Snowden

2010

Materials Science and Engineering: A

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“…If the cycles have sufficient half-cycle dwell times to result in complete stress-relaxation/creep, then ∆D = ∆W. Englemaier has suggested that the fatigue ductility exponent is a function of temperature and time: [172] 0.37 63Sn-37Pb Anderson, et al [97] 0.42 SAC Lee, et al [98] 0.43 Sn-Cu Kariya, et al [173] 0.44 SAC Lee, et al [98] 0.57 Sn-Ag Akay, et al [165] 0.63 SAC Wu, et al [166] 0.68 SAC Lee, et al [98] 0.74 SAC Lee, et al [94] 0.87 Sn-Ag-Bi Pang, et al [174] 0.99 Sn-Cu Kanchanomai, et al [176] 1.14 Sn-Ag-Cu-Bi [91] 0.37 Sn-Pb Anderson, et al [100] 0.42 SAC Kanda, et al [91] 0.49 SAC Lau, et al [100] 0.51 SAC Akay, et al [165] 0.63 SAC Wu, et al [166] 0.68 SAC Shi, et al [70] 0.70 Sn-Pb Pang, et al [101] 0.87 SAC0387 Kim, et al [92] 0.88 SAC405 Ahmer, et al [167] 1.00 SAC Jung, et al [168] 1.00 63Sn37Pb Dudek, et al [169] 1.00 SAC Pang, et al [170] 1.07 SAC at 25C Chi, et al [171] 1.10 SAC Lee, et al [98] 1.17 Sn3.5Ag7.5Bi…”

Section: Fatigue Life Predictionmentioning

confidence: 99%

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Mustafa

Roberts

Suhling

et al. 2013

Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; M

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Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials cause the solder joints to be subjected to cyclic (positive and negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. In addition, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the effects of aging on solder constitutive behavior (stress-strain and creep) have been examined in some detail, there have been no prior studies on the effects of aging on solder failure and fatigue behavior. Aging leads to both grain and phase coarsening, and can cause recrystallization at Sn grain boundaries. Such changes are closely tied to the damage that occurs during cyclic mechanical loading. In this investigation, we have examined the effects of aging on the cyclic stress-strain behavior and fatigue life of lead free solders. Uniaxial solder test specimens (SAC105 and SAC305) have been prepared and subjected to cyclic stress/strain loading at different aging conditions. A four-parameter hyperbolic tangent empirical model has been used to fit the entire cyclic stress-strain curve and the hysteresis loop size (area) was calculated using definite integration for a given strain limit. This area represents the energy dissipated per cycle, which is correlated to the damage accumulation in the joint. Using the recorded cyclic stress-strain curves, the evolution of the solder hysteresis loops with aging have been characterized and empirically modeled. Similar to solder stress-strain and creep behavior, there is a strong effect of aging on the hysteresis loop size (and thus the rate of damage accumulation) in the solder specimens. Fatigue experiments were also performed, where the uniaxial specimens were subjected to cyclic loading over a particular strain range until failure. Fatigue failure in the experiments was defined to occur when there was a 50% peak load drop during mechanical cycling. Prior to testing, the specimens were aged (preconditioned) at 125 °C for various aging times, and then the samples were subjected to cyclic loading at room temperature (25 °C). It was found that aging decreased the mechanical fatigue life, and the effects of aging on the peak load drop have been studied. It has also been observed that degradations in the fatigue/failure behavior of the lead free solders with aging are highly accelerated for lower silver content alloys (e.g., SAC105). Various empirical failure criteria such as the Coffin-Manson model and the Morrow model have been used to fit the measured data, and the parameters in the models have been determined as a function of the aging conditions.

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Reliability analysis for fine pitch BGA package

Cited by 11 publications

References 0 publications

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

A strain energy density method for the prediction of creep–fatigue damage in high temperature components

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

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