Abstract:Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials cause the solder joints to be subjected to cyclic (positive and negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. In addition, the mic… Show more
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