Abstract:Thermal shock test was performed on the SnAg3. 8CuO. 7 (SAC387) solder bump interconnecting AIN and Cu substrate. Finite element modeling (FEM), cross-polarized light microscopy, scanning electronic microscopy (SEM) and EBSD were used to analyze the failure mechanism of them. It was realized that during thermal shock, the areas with higher stress would suffer from more serious IMC coarsening and then lead to easier propagation for the cracks. The recrystallization phenomena and crack could also be observed aft… Show more
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